MCP2140A-I/P Microchip Technology, MCP2140A-I/P Datasheet - Page 44
![IC IRDA CONTROLLR DTE/DCE 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
MCP2140A-I/P
Manufacturer Part Number
MCP2140A-I/P
Description
IC IRDA CONTROLLR DTE/DCE 18DIP
Manufacturer
Microchip Technology
Specifications of MCP2140A-I/P
Package / Case
18-DIP (0.300", 7.62mm)
Controller Type
IRDA Standard Protocol Stack Controller
Interface
UART
Voltage - Supply
3 V ~ 5.5 V
Current - Supply
2.2mA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Product
Controller Area Network (CAN)
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Ic Function
Standard Protocol Stack Controller
Brief Features
Includes UART-to-IrDA Standard Encoder/decoder Functionality, Infrared Supported
Supply Voltage Range
2V To 5.5V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP2140DM-TMPSNS - BOARD DEMO FOR MCP2140
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP2140A-I/P
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
MCP2140A-I/P
Manufacturer:
Microchip
Quantity:
73
Part Number:
MCP2140A-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP2140A
DS22050A-page 44
18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
NOTE 1
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A1
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
1
2
b
b1
3
D
Dimension Limits
Units
e
A2
A1
E1
eB
b1
N
D
A
E
e
L
c
b
E1
A2
MIN
.115
.015
.300
.240
.880
.115
.008
.045
.014
–
–
L
.100 BSC
INCHES
NOM
.130
.310
.250
.900
.130
.010
.060
.018
18
–
–
–
Microchip Technology Drawing C04-007B
© 2007 Microchip Technology Inc.
E
eB
MAX
.210
.195
.325
.280
.920
.150
.014
.070
.022
.430
–
c