MCP2515-I/ST Microchip Technology, MCP2515-I/ST Datasheet - Page 74
![IC CAN CONTROLLER W/SPI 20TSSOP](/photos/6/81/68121/150-20-tssop_sml.jpg)
MCP2515-I/ST
Manufacturer Part Number
MCP2515-I/ST
Description
IC CAN CONTROLLER W/SPI 20TSSOP
Manufacturer
Microchip Technology
Specifications of MCP2515-I/ST
Package / Case
20-TSSOP
Controller Type
CAN Interface
Interface
SPI
Voltage - Supply
2.7 V ~ 5.5 V
Current - Supply
10mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Product
Controller Area Network (CAN)
Number Of Transceivers
1
Data Rate
1 Mbps
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.7 V
Supply Current (max)
10 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage Range
2.7V To 5.5V
Driver Case Style
TSSOP
No. Of Pins
20
Operating Temperature Range
-40°C To +85��C
Filter Terminals
SMD
Supply Voltage Min
2.7V
Rohs Compliant
Yes
Interface Type
SPI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP2515DM-BM - BOARD DEMO FOR MCP2515/51MCP2515DM-PTPLS - BOARD DAUGHTER PICTAIL MCP2515MCP2515DM-PCTL - BOARD DEMO FOR MCP2515DV251001 - KIT DEVELOPMENT CAN MCP2510
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP2515-I/ST
Manufacturer:
HYNIX
Quantity:
7 600
Company:
Part Number:
MCP2515-I/ST
Manufacturer:
MICROCHI
Quantity:
5 920
Company:
Part Number:
MCP2515-I/ST
Manufacturer:
MICROCHI
Quantity:
200
Part Number:
MCP2515-I/ST
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP2515
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS21801B-page 74
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
E1
E
eB
Dimension Limits
2
1
§
D
c
Units
A2
eB
A1
E1
B1
E
D
B
n
p
A
L
c
MIN
A1
A
Preliminary
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
2003 Microchip Technology Inc.
p
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
18
10
10
MAX
A2
L
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15