UJA1079TW/3V3/WD,1 NXP Semiconductors, UJA1079TW/3V3/WD,1 Datasheet - Page 38

• Manufacturer Part Number: UJA1079TW/3V3/WD,1
• Description: IC SBC LINE 3.3V 32HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1079TW/3V3/WD,1

• Controller Type: System Basis Chip
• Interface: SPI
• Voltage - Supply: 4.5 V ~ 28 V
• Current - Supply: 75µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
12. Package outline
Fig 16. Package outline SOT549-1 (HTSSOP32)
UJA1079_2
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
All information provided in this document is subject to legal disclaimers.
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
0
Rev. 02 — 27 May 2010
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
detail X
EUROPEAN
LIN core system basis chip
0.2
v
L
L
p
0.1
w
UJA1079
© NXP B.V. 2010. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
θ
X
Z
SOT549-1
A
v
M
8
0
θ
o
o
38 of 45
A