UJA1076TW/5V0/WD:1 NXP Semiconductors, UJA1076TW/5V0/WD:1 Datasheet - Page 43
UJA1076TW/5V0/WD:1
Manufacturer Part Number
UJA1076TW/5V0/WD:1
Description
IC SBC CAN HS 5V 32HTSSOP
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1076TW5V0118.pdf
(47 pages)
Specifications of UJA1076TW/5V0/WD:1
Controller Type
System Basis Chip
Interface
SPI
Voltage - Supply
4.5 V ~ 28 V
Current - Supply
82µA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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NXP Semiconductors
UJA1076_2
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Fig 19. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 May 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
High-speed CAN core system basis chip
temperature
peak
UJA1076
© NXP B.V. 2010. All rights reserved.
001aac844
time
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