AAT3221IGV-3.0-T1 Analogic Tech, AAT3221IGV-3.0-T1 Datasheet - Page 13

• Manufacturer Part Number: AAT3221IGV-3.0-T1
• Description: Low Dropout (LDO) Regulators 150mA NanoPower LDO Linear Regulator
• Manufacturer: Analogic Tech

Specifications of AAT3221IGV-3.0-T1

• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 7 V
• Output Voltage: 3 V
• Output Type: Fixed
• Dropout Voltage (max): 0.225 V at 100 mA
• Output Current: 150 mA
• Line Regulation: 0.4 % / V
• Load Regulation: 1.15 %
• Voltage Regulation Accuracy: 2 %
• Maximum Power Dissipation: 0.667 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: SOT-23-5
• Minimum Operating Temperature: - 40 C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PowerLinear
The power dissipation for a 150mA load occurring for
8.2% of the duty cycle will be 20.9mW. Finally, the two
power dissipation levels can summed to determine the
total true power dissipation under the varied load:
P
P
P
The maximum power dissipation for the AAT3221/2
operating at an ambient temperature of 85°C is 267mW.
The device in this example will have a total power dis-
sipation of 260.25mW. This is within the thermal limits
for safe operation of the device.
3221.2007.11.1.12
D(total)
D(total)
D(total)
= P
= 229.5mW + 30.75mW
= 260.25mW
D(100mA)
+ P
TM
D(150mA)
w w w . a n a l o g i c t e c h . c o m
150mA NanoPower™ LDO Linear Regulator
Printed Circuit Board Layout
Recommendations
In order to obtain the maximum performance from the
AAT3221/2 LDO regulator, very careful attention must
be considered in regard to the printed circuit board lay-
out. If grounding connections are not properly made,
power supply ripple rejection and LDO regulator tran-
sient response can be compromised.
The LDO regulator external capacitors C
should be connected as directly as possible to the ground
pin of the LDO regulator.
with the AAT3221/2, the ground pin connection should
then be made directly back to the ground or common of
the source power supply. If a direct ground return path
is not possible due to printed circuit board layout limita-
tions, the LDO ground pin should then be connected to
the common ground plane in the application layout.
PRODUCT DATASHEET
AAT3221/2
For maximum performance
IN
and C
OUT
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