LTC2852IMS#PBF Linear Technology, LTC2852IMS#PBF Datasheet - Page 14

• Manufacturer Part Number: LTC2852IMS#PBF
• Description: IC TXRX RS485/RS422 10MSOP
• Manufacturer: Linear Technology
• Type: Transceiverr

Specifications of LTC2852IMS#PBF

• Number Of Drivers/receivers: 1/1
• Protocol: RS422, RS485
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Data Rate: 20Mbps
• Number Of Receivers: 1
• Number Of Transmitters: 1
• Number Of Transceivers: 1
• Data Transmission Topology: Multidrop/Multipoint
• Receiver Signal Type: Differential
• Transmitter Signal Type: Differential
• Single Supply Voltage (typ): 3.3V
• Single Supply Voltage (min): 3V
• Single Supply Voltage (max): 3.6V
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Supply Current: 1mA
• Power Supply Requirement: Single
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 10
• Package Type: MSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

package DescripTion
LTC2850/LTC2851/LTC2852

3.55 0.05
2.15 0.05
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.25 0.05
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
1.65 0.05
(2 SIDES)
3.5 0.05
2.10 0.05
2.38 0.05
(2 SIDES)
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
1.65 0.05
(2 SIDES)
0.50
BSC
(NOTE 6)
0.25 0.05
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
0.70 0.05
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
PACKAGE
OUTLINE
2.38 0.05
(Reference LTC DWG # 05-08-1698 Rev C)
(Reference LTC DWG # 05-08-1699 Rev B)
10‑Lead Plastic DFN (3mm × 3mm)
8‑Lead Plastic DFN (3mm × 3mm)
(SEE NOTE 6)
0.50
BSC
TOP MARK
PIN 1
0.200 REF
0.75 0.05
3.00 0.10
0.70 0.05
(4 SIDES)
DD Package
DD Package
PACKAGE
OUTLINE
0.00 – 0.05
1.65 0.10
(2 SIDES)
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
BOTTOM VIEW—EXPOSED PAD
0.25 0.05
R = 0.125
3.00 0.10
0.75 0.05
(4 SIDES)
TYP
4
5
2.38 0.10
0.00 – 0.05
1.65 0.10
(2 SIDES)
8
1
0.50 BSC
0.40 0.10
BOTTOM VIEW—EXPOSED PAD
(DD8) DFN 0509 REV C
R = 0.125
6
5
2.38 0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 0.05
0.40 0.10
(DD) DFN REV C 0310
PIN 1 NOTCH
R = 0.20 OR
0.35 45
CHAMFER
285012fd