MCP2003-E/MD Microchip Technology, MCP2003-E/MD Datasheet
MCP2003-E/MD
Specifications of MCP2003-E/MD
Related parts for MCP2003-E/MD
MCP2003-E/MD Summary of contents
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... LIN J2602 Transceiver Features • The MCP2003 and MCP2004 are compliant with LIN Bus Specifications 1.3, 2.0 and 2.1 and are compliant to SAE J2602 • Support Baud Rates Kbaudwith LIN-compatible output driver • 43V load dump protected • Very low EMI meets stringent OEM requirements • ...
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... MCP2003/4 MCP2003 Block Diagram V REN WAKE MCP2004 Block Diagram V REN FAULT/TXE DS22230C-page 2 Ratiometric Reference Wake-Up Logic and Power Control OC Thermal Short Circuit Protection Protection Ratiometric Reference Wake-Up Logic and Power Control OC Thermal Short Circuit Protection Protection 2010 Microchip Technology Inc. ...
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... DEVICE OVERVIEW The MCP2003/4 provides a physical interface between a microcontroller and a LIN bus. This device will translate the CMOS/TTL logic levels to LIN logic level, and vice versa intended for automotive and industrial applications with serial bus speeds Kbaud. LIN specification 2.1 requires that the transceiver of all ...
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... In this mode, all internal modules are operational. are REN The MCP2003/4 will go into the Power-Down mode on the falling edge of CS. The MCP2003/4 will enter Transmitter Off mode in the event of a Fault condition. These include: thermal overload, bus contention and T timer expiration. ...
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... OPERATIONAL MODES STATE DIAGRAM – MCP2004 POR VREN OFF VBAT > 5.5V RX OFF TX OFF Falling edge on LIN Note: While the MCP2003 thermal shutdown, T internal logic through the ESD diodes and may damage the device. TABLE 1-1: OVERVIEW OF OPERATIONAL MODES State Transmitter Receiver POR OFF OFF ...
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... MCP2003/4 1.4 Typical Applications EXAMPLE 1-1: TYPICAL MCP2003 APPLICATION 220 K I/O 100 nF Note: For applications with current requirements of less than 20 mA, the connection to +12V can be deleted, and voltage to the regulator supplied directly from the V EXAMPLE 1-2: TYPICAL MCP2004 APPLICATION Wake-up 220 K ...
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... EXAMPLE 1-3: TYPICAL LIN NETWORK CONFIGURATION 1 k LIN bus MCP200X Master µC 2010 Microchip Technology Inc. 40m + Return LIN bus LIN bus MCP200X MCP200X Slave 1 Slave 2 µC µC MCP2003/4 LIN bus LIN bus MCP200X Slave n <23 µC DS22230C-page 7 ...
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... Vss ) 1.5.3 WAKE UP INPUT (WAKE) XD This pin is only available on the MCP2003. The WAKE pin has an internal 800K pull falling edge on the WAKE pin causes the device to wake from Power-Down mode. Upon waking, the MCP2003 will enter Ready mode 1.5.4 FAULT/TXE This pin is only available on the MCP2004 ...
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... VOLTAGE REGULATOR ENABLE OUTPUT (V This is the External Voltage Regulator Enable pin. Open source output is pulled high to V except Power Down. 1.5.10 EXPOSED THERMAL PAD (EP) Do not electrically connect, or connect to Vss. to follow XD MCP2003/4 Definition driven low, LIN shorted BUS BB BUS transmitter after approximately BUS pin ...
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... MCP2003/4 NOTES: DS22230C-page 10 2010 Microchip Technology Inc. ...
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... SUP I _ BUS LIM V BUSREC V BUSDOM 2010 Microchip Technology Inc. .......................................................................................................-0.3 to +30V Term used in the following tables not used BUS BUS MCP2003/4 Example 1-2). Definition ECU operating voltage Supply voltage at device pin Current Limit of Driver Recessive state Dominant state DS22230C-page 11 ...
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... MCP2003/4 2.3 DC Specifications Electrical Characteristics: Unless otherwise indicated, all limits are specified for: DC Specifications V = 6.0V to 27. -40°C to +125°C A Parameter Sym Power V Quiescent Operating I BB BBQ Current V Transmitter-off Current I BB BBTO V Power Down Current I BB BBPD V Current I BB BBNOGND with V Floating ...
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... -0.4 — DOM _ — REC _ -10 1.0 +10 GND — — 0.475 V 0.5 0.525 V CNT 0 0.4 V LBUS MCP2003/4 Units Conditions V Recessive state V Dominant state – BUS IL BUS mA Output voltage = 0 12V BB µA ~30 k internal pull- 0 BUS BB mA (Note 1) V ...
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... MCP2003/4 2.4 AC Specifications V = 6.0V to 27.0V CHARACTERISTICS Parameter Sym Bus Interface – Constant Slope Time Parameters Slope Rising and Falling tslope Edges Propagation Delay of ttranspd Transmitter Propagation Delay of trecpd Receiver Symmetry of Propagation trecsym Delay of Receiver Rising Edge w.r.t. Falling Edge Symmetry of Propagation ...
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... Thermal Resistance, 8L-SOIC Note 1: The maximum power dissipation is a function of T allowable power dissipation at an ambient temperature is P exceeded, the die temperature will rise above 150C and the MCP2003/4 will go into thermal shutdown. 2010 Microchip Technology Inc. Symbol Typ ...
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... MCP2003/4 2.6 Typical Performance Curves Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e ...
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... FIGURE 2-6: BUS TO V REN L BUS REN 2010 Microchip Technology Inc. 50% T TRANSPDF T RECPDF 50% Match Match T FAULT Stable Value T CSOR T CSPD WAKE TIMING DIAGRAM . BDB BACTVE MCP2003/4 .95V LBUS .50V BB 0.5V LBUS 0.0V T TRANSPDR T RECPDR 50% Match T FAULT Hold Stable DS22230C-page 17 ...
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... MCP2003/4 NOTES: DS22230C-page 18 2010 Microchip Technology Inc. ...
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... In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2010 Microchip Technology Inc. MCP2003/4 : Example 2004 E/MD 0948 256 Example: MCP2003 e E/P^^256 3 0948 Example: MCP2003E e SN^^0948 3 256 DS22230C-page 19 ...
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... MCP2003/4 8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22230C-page 20 Microchip Technology Drawing C04-131E Sheet 2010 Microchip Technology Inc. ...
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... Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2010 Microchip Technology Inc. MCP2003/4 Microchip Technology Drawing C04-131E Sheet DS22230C-page 21 ...
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... MCP2003/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22230C-page 22 2010 Microchip Technology Inc. ...
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... N NOTE 1RWHV 2010 Microchip Technology Inc. PLO %RG\ >3', MCP2003/4 c DS22230C-page 23 ...
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... MCP2003/4 Note: DS22230C-page 24 2010 Microchip Technology Inc. ...
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... Note: 2010 Microchip Technology Inc. MCP2003/4 DS22230C-page 25 ...
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... MCP2003/4 /HDG 3ODVWLF 6PDOO 2XWOLQH 61 ± 1DUURZ 1RWH DS22230C-page 26 PP %RG\ >62,&@ 2010 Microchip Technology Inc. ...
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... Slave Node” parameter to Table 2.3. Revision C (August 2010) • Updated all references of Sleep mode to Power- Down mode, and updated the Max. parameter for Duty Cycle 2 in Section 2.4 “AC Specifica- tions”. 2010 Microchip Technology Inc. MCP2003/4 DS22230C-page 27 ...
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... MCP2003/4 NOTES: DS22230C-page 28 2010 Microchip Technology Inc. ...
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... MCP2004-E/SN: Extended Temperature, 8L-SOIC pkg. d) MCP2004T-E/MD: Tape and Reel, Extended Temperature, 8L-DFN pkg. e) MCP2004T-E/SN: Tape and Reel, Extended Temperature, 8L-SOIC pkg. a) MCP2003-E/MD: Extended Temperature, 8L-DFN pkg. b) MCP2003-E/P: Extended Temperature, 8L-PDIP pkg. c) MCP2003-E/SN: Extended Temperature, 8L-SOIC pkg. d) MCP2003T-E/MD: Tape and Reel, Extended Temperature, 8L-DFN pkg ...
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... MCP2003/4 NOTES: DS22230C-page 30 2010 Microchip Technology Inc. ...
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... PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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