MCP2021-500E/SN Microchip Technology, MCP2021-500E/SN Datasheet - Page 3

• Manufacturer Part Number: MCP2021-500E/SN
• Description: IC LIN TXRX ON-BOARD VREG 8SOIC
• Manufacturer: Microchip Technology
• Type: Transceiverr

Specifications of MCP2021-500E/SN

• Number Of Drivers/receivers: 1/1
• Protocol: LIN
• Voltage - Supply: 6 V ~ 18 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Data Rate: 20Kbps
• Supply Voltage Range: 6V To 18V
• Logic Case Style: SOIC
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +125°C
• Interface: EUSART
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Driver Case Style: SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: APGRD004 - REF DESIGN MOD AUTO AMBNT LIGHTAC164130 - BOARD DAUGHT PICTL PLUS ECAN/LIN
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

1.0
The MCP2021/2 provides a physical interface between
a microcontroller and a LIN half-duplex bus. It is
intended for automotive and industrial applications with
serial bus speeds up to 20 Kbaud.
The MCP2021/2 provides a half-duplex, bidirectional
communications interface between a microcontroller
and the serial network bus. This device will translate
the CMOS/TTL logic levels to LIN level logic, and vice
versa.
The LIN specification 2.0 requires that the transceiver
of all nodes in the system be connected via the LIN pin,
referenced to ground and with a maximum external
termination resistance of 510Ω from LIN bus to battery
supply. The 510Ω corresponds to 1 Master and 16
Slave nodes.
The MCP2021-500 provides a +5V 50 mA regulated
power output. The regulator uses a LDO design, is
short-circuit-protected and will turn the regulator output
off if it falls below 3.5V. The MCP2021/2 also includes
thermal shutdown protection. The regulator has been
specifically designed to operate in the automotive
environment and will survive reverse battery connec-
tions, +43V load dump transients and double-battery
jumps. The other members of the MCP2021-330 family
output +3.3V at 50 mA with a turn-off voltage of 2.5V.
(see Section 1.6 “Internal Voltage Regulator”).
1.1
1.1.1
An external reverse-battery-blocking diode should be
used to provide polarity protection (see Example 1-1).
1.1.2
An external 43V transient suppressor (TVS) diode,
between V
protection resistor (R
supply and the V
power transients (see
While this protection is optional, it should be
considered as good engineering practice.
EQUATION 1-1:
© 2009 Microchip Technology Inc.
250 mA is the peak current at power-on when
DEVICE OVERVIEW
Optional External Protection
REVERSE BATTERY PROTECTION
TRANSIENT VOLTAGE
PROTECTION (LOAD DUMP)
BB
R
TP
and ground, with a 50Ω transient
<= (V
BB
5.5V = V
pin serve to protect the device from
V
BB min
TP
Example
BB
) in series with the battery
UVLO
= 5.5V
- 5.5) / 250 mA.
+ 1.0V,
1-1) and ESD events.
1.2
1.2.1
For component-level ESD ratings, please refer to the
maximum operation specifications.
1.2.2
The LIN Bus specification states that the LIN pin must
transition to the recessive state when ground is
disconnected. Therefore, a loss of ground effectively
forces the LIN line to a hi-impedance level.
1.2.3
The thermal protection circuit monitors the die
temperature and is able to shut down the LIN
transmitter and voltage regulator.
There are three causes for a thermal overload. A
thermal shut down can be triggered by any one, or a
combination of, the following thermal overload
conditions.
• Voltage regulator overload
• LIN bus output overload
• Increase in die temperature due to increase in
Driving the TXD and checking the RXD pin makes it
possible to determine whether there is a bus contention
(Rx = low, Tx = high) or a thermal overload condition
(Rx = high, Tx = low).
FIGURE 1-1:
environment temperature
Regulator
Shutdown
Voltage
Internal Protection
Temp <
ESD PROTECTION
GROUND LOSS PROTECTION
THERMAL PROTECTION
Output
Overload
SHUTDOWN TEMP
THERMAL SHUTDOWN
STATE DIAGRAMS
Operation
MCP2021/2
Mode
Temp <
LIN bus
shorted
to V
BB
SHUTDOWN
DS22018E-page 3
Transmitter
Shutdown
TEMP