MCP201-I/P Microchip Technology, MCP201-I/P Datasheet - Page 33

• Manufacturer Part Number: MCP201-I/P
• Description: IC LIN TXRX ON-BOARD VREG 8DIP
• Manufacturer: Microchip Technology
• Type: Line Transceiverr

Specifications of MCP201-I/P

• Number Of Drivers/receivers: 1/1
• Protocol: LIN
• Voltage - Supply: 6 V ~ 18 V
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Output Voltage: 5V
• Output Current: 50mA
• Supply Voltage Range: 6V To 18V
• Baud Rate: 20Kbaud
• Digital Ic Case Style: DIP
• No. Of Pins: 8
• Supply Voltage Max: 18V
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
© 2007 Microchip Technology Inc.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
e
Units
L
A2
A1
E1
eB
b1
E1
N
A
E
D
e
L
c
b
A2
.115
.015
.290
.240
.348
.115
.008
.040
.014
MIN
–
–
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
–
–
–
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–
MCP201
DS21730F-page 33