MAX3030ECUE+ Maxim Integrated Products, MAX3030ECUE+ Datasheet - Page 9

IC RS-422 TRANSMIT QUAD 16TSSOP

MAX3030ECUE+

Manufacturer Part Number
MAX3030ECUE+
Description
IC RS-422 TRANSMIT QUAD 16TSSOP
Manufacturer
Maxim Integrated Products
Type
Transmitterr
Datasheet

Specifications of MAX3030ECUE+

Number Of Drivers/receivers
4/0
Protocol
RS422
Voltage - Supply
3 V ~ 3.6 V
Mounting Type
Surface Mount
Package / Case
16-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
The Machine Model for ESD tests all pins using a
200pF storage capacitor and zero discharge resis-
tance. Its objective is to emulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. Of course, all pins require this protec-
tion during manufacturing, not just inputs and outputs.
Therefore, after PC board assembly, the Machine
Model is less relevant to I/O ports.
When circuit boards are plugged into a “hot” back-
plane, there can be disturbances to the differential sig-
nal levels that could be detected by receivers
connected to the transmission line. This erroneous data
could cause data errors to an RS-422 system. To avoid
this, the MAX3030E–MAX3033E have hot-swap capa-
ble inputs.
When a circuit board is plugged into a “hot” backplane,
there is an interval during which the processor is going
through its power-up sequence. During this time, the
processor’s output drivers are high impedance and are
unable to drive the enable inputs of the MAX3030E–
MAX3033E (EN, EN, EN_) to defined logic levels.
Leakage currents from these high-impedance drivers,
of as much as 10µA, could cause the enable inputs of
the MAX3030E–MAX3033E to drift high or low.
Additionally, parasitic capacitance of the circuit board
could cause capacitive coupling of the enable inputs to
either GND or V
enable inputs of the MAX3030E–MAX3033E to drift to
levels that may enable the transmitter outputs. To avoid
this problem, the hot-swap input provides a method of
holding the enable inputs of the MAX3030E–MAX3033E
in the disabled state as V
input is able to overcome the leakage currents and par-
asitic capacitances that can pull the enable inputs to
the enabled state.
In the MAX3030E–MAX3033E, the enable inputs feature
hot-swap capability. At the input there are two NMOS
devices, M1 and M2 (Figure 10). When V
up from zero, an internal 6µs timer turns on M2 and sets
the SR latch, which also turns on M1. Transistors M2, a
2mA current sink, and M1, a 100µA current sink, pull EN
to GND through a 5.6kΩ resistor. M2 is designed to pull
the EN input to the disabled state against an external
parasitic capacitance of up to 100pF that is trying to
enable the EN input. After 6µs, the timer turns M2 off and
M1 remains on, holding the EN input low against three-
state output leakages that might enable EN. M1 remains
on until an external source overcomes the required input
CC
_______________________________________________________________________________________
. These factors could cause the
Hot-Swap Input Circuitry
CC
ramps up. This hot-swap
±15kV ESD-Protected, 3.3V Quad
Machine Model
Hot Swap
CC
is ramping
current. At this time the SR latch resets and M1 turns off.
When M1 turns off, EN reverts to a standard, high-
impedance CMOS input. Whenever V
1V, the hot-swap input is reset. The EN1&2 and EN3&4
input structures are identical to the EN input. For the EN
input, there is a complementary circuit employing two
PMOS devices pulling the EN input to V
The circuit of Figure 11 shows a typical offset termina-
tion used to guarantee a greater than 200mV offset
when a line is not driven. The 50pF capacitor repre-
Figure 10. Simplified Structure of the Driver Enable Pin (EN)
Figure 11. Differential Power-Up Glitch (Hot Swap)
EN
(V
CC
RS-422 Transmitters
OR GND)
TIMER
5.6kΩ
V
TIMER
CC
M1
DI_
100µA
V
CC
DO_-
DO_+
2mA
6µs
Hot-Swap Line Transient
M2
3.3V
1kΩ
0.1kΩ
1kΩ
CC
CC
.
drops below
50pF
DE
(HOT SWAP)
9

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