LTC2856IMS8-1#TRPBF Linear Technology, LTC2856IMS8-1#TRPBF Datasheet - Page 17
![IC TXRX RS485/RS422 8-MSOP](/photos/6/57/65743/8-msop_05-08-1660_sml.jpg)
LTC2856IMS8-1#TRPBF
Manufacturer Part Number
LTC2856IMS8-1#TRPBF
Description
IC TXRX RS485/RS422 8-MSOP
Manufacturer
Linear Technology
Type
Transceiverr
Datasheet
1.LTC2856CMS8-2PBF.pdf
(20 pages)
Specifications of LTC2856IMS8-1#TRPBF
Number Of Drivers/receivers
1/1
Protocol
RS422, RS485
Voltage - Supply
4.5 V ~ 5.5 V
Mounting Type
Surface Mount
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PACKAGE DESCRIPTION
3.50 0.05
2.15 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
1.65 0.05
0.25 0.05
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
(2 SIDES)
2.38 0.05
(2 SIDES)
0.50
BSC
0.675 0.05
PACKAGE
OUTLINE
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
(SEE NOTE 6)
TOP MARK
PIN 1
DD Package
0.200 REF
LTC2857-1/LTC2857-2
LTC2858-1/LTC2858-2
3.00 0.10
0.75 0.05
(4 SIDES)
0.00 – 0.05
1.65 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5
R = 0.115
6
2.38 0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 0.05
0.38 0.10
17
(DD) DFN 1103
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