BU25065S-E3/45 General Semiconductor / Vishay, BU25065S-E3/45 Datasheet
BU25065S-E3/45
Specifications of BU25065S-E3/45
Related parts for BU25065S-E3/45
BU25065S-E3/45 Summary of contents
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... UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option + (part number with “5S” suffix, e. BU25065S) - • Superior thermal conductivity • Solder dip 260 ° • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC TYPICAL APPLICATIONS ...
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... THERMAL CHARACTERISTICS (T PARAMETER Typical thermal resistance Notes: (1) With 60 W air cooled heatsink (2) Without heatsink, free air ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) BU2506-E3/45 4.84 BU2506-E3/51 4.84 BU25065S-E3/45 4.84 RATINGS AND CHARACTERISTICS CURVES ( °C unless otherwise noted With Heatsink Sine-Wave, R-Load ...
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BU2506 thru BU2510 Vishay General Semiconductor PACKAGE OUTLINE DIMENSIONS in inches (millimeters) Case Type BU 0.125 (3.2) x 45° Chamfer 0.075 0.080 (2.03) (1.9) R 0.060 (1.52) + 0.050 (1.27) 0.040 (1.02) Polarity shown on front side of case, positive ...
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FORMING SPECIFICATION: BU-5S in inches (millimeters) 0.125 (3.2) x 45° Chamfer 0.075 (1. 0.080 (2.03) 0.060 (1.52) 0.050 (1.27) 0.040 (1.02) 0.213 (5.40) 0.173 (4.40) 0.417 (10.60) 0.370 (9.40) APPLICATION NOTE (1) Device UL approved for safety use ...