TJA1040T/VM,118 NXP Semiconductors, TJA1040T/VM,118 Datasheet - Page 11
TJA1040T/VM,118
Manufacturer Part Number
TJA1040T/VM,118
Description
IC CAN TRANSCEIVER HS 8-SOIC
Manufacturer
NXP Semiconductors
Type
Transceiverr
Datasheet
1.TJA1040TVM118.pdf
(17 pages)
Specifications of TJA1040T/VM,118
Number Of Drivers/receivers
1/1
Protocol
CAN
Voltage - Supply
4.75 V ~ 5.25 V
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4819-2
935287961118
935287961118
Philips Semiconductors
BONDING PAD LOCATIONS
Note
1. All x/y coordinates represent the position of the centre
2003 Oct 14
TXD
GND
V
RXD
SPLIT
CANL
CANH
STB
CC
High speed CAN transceiver
SYMBOL
of each pad (in m) with respect to the left hand
bottom corner of the top aluminium layer (see Fig.9).
PAD
1
2
3
4
5
6
7
8
1214.25
1635.25
1516.5
530.25
113.75
119.5
648.5
990.5
COORDINATES
x
1273.75
1273.75
114.5
114.5
114.5
1275
1246
(1)
85
y
11
handbook, halfpage
The backside of the bare die must be connected to ground.
x
0
0
y
Fig.9 Bonding pad locations.
8
1
TJA1040U
7
2
6
3
Product specification
5
4
TJA1040
test pad 1
test pad 2
MBL584