TJA1055T/3/C,512 NXP Semiconductors, TJA1055T/3/C,512 Datasheet - Page 22

• Manufacturer Part Number: TJA1055T/3/C,512
• Description: IC CAN TXRX FAULT-TOL 14-SOIC
• Manufacturer: NXP Semiconductors
• Type: Transceiverr

Specifications of TJA1055T/3/C,512

• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Number Of Drivers/receivers: 1/1
• Protocol: CAN
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Product: Controller Area Network (CAN)
• Number Of Transceivers: 1
• Data Rate: 125 KBd
• Supply Voltage (max): 5.25 V, 40 V
• Supply Voltage (min): 4.75 V, 5 V
• Supply Current (max): 0.22 mA, 21 mA
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935285401512; TJA1055T/3/C; TJA1055T/3/C

NXP Semiconductors
TJA1055_4
Product data sheet
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 10.
Table 11.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
11
Rev. 04 — 17 February 2009
12.
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
Enhanced fault-tolerant CAN transceiver
350 to 2000
260
250
245
12) than a SnPb process, thus
220
220
350
> 2000
260
245
245
© NXP B.V. 2009. All rights reserved.
TJA1055
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