MAX8521ETP Maxim Integrated Products, MAX8521ETP Datasheet - Page 2

• Manufacturer Part Number: MAX8521ETP
• Description: Other Power Management TEC Power Driver for Optical Modules
• Manufacturer: Maxim Integrated Products

Specifications of MAX8521ETP

• Output Voltage Range: - 4.3 V to + 4.3 V
• Output Current: 1.5 A
• Input Voltage Range: 3 V to 5.5 V
• Input Current: 14 mA
• Power Dissipation: 1.67 W
• Operating Temperature Range: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TQFN-20
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
V
SHDN, MAXV, MAXIP, MAXIN,
COMP, FREQ, OS1, OS2, CS, REF,
PVDD1, PVDD2 to GND .............................-0.3V to (V
PVDD1, PVDD2 to V
PGND1, PGND2 to GND .......................................-0.3V to +0.3V
COMP, REF, ITEC short to GND....................................Indefinite
LX Current (Note 1) ........................................±2.25A LX Current
Continuous Power Dissipation (T
PACKAGE THERMAL CHARACTERISTICS (Note 3)
20 TQFN
6x6 UCSP
ELECTRICAL CHARACTERISTICS
(V
T
Smallest TEC Power Drivers for Optical
Modules
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: LX has internal clamp diodes to PGND and PVDD. Applications that forward bias these diodes should take care not to
Note 2: Solders underside metal slug to PCB ground plane.
2
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Input Supply Range
Maximum TEC Current
Reference Voltage
Reference Load Regulation
MAXIP/MAXIN Threshold
Accuracy
nFET On-Resistance
pFET On-Resistance
nFET Leakage
pFET Leakage
A
DD
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
DD
CTLI to GND .........................................................-0.3V to +6V
ITEC to GND...........................................-0.3V to (V
= 0°C to +85°C, unless otherwise noted. Typical values at T
_______________________________________________________________________________________
to GND ..............................................................-0.3V to +6V
= V
exceed the IC’s package power dissipation limits.
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PVDD1
PARAMETER
= V
PVDD2
DD
..........................................-0.3V to +0.3V
= V
SHDN
A
= +70°C)
= 5V, 1MHz mode (Note 4). PGND1 = PGND2 = GND, CTLI = MAXV = MAXIP = MAXIN = REF,
R
R
SYMBOL
I
I
JC
DS(ON-N)
DS(ON-P)
LEAK(N)
LEAK(P)
∆V
JC
V
V
).......................0°C/W
REF
JA
)......................2°C/W
DD
REF
JA
)................65.5°C/W
)...............30°C/W
V
V
V
V
V
V
V
V
V
V
V
V
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
LX
LX
LX
LX
= V
= V
= 0V, T
= 0V, T
= 3V to 5.5V, I
= 3V to 5V, I
= 5V
= 3V
= 5V, I = 0.2A
= 3V, I = 0.2A
= 5V, I = 0.2A
= 3V, I = 0.2A
+ 0.3V)
+ 0.3V)
DD
DD
A
= 5V, T
= 5V T
A
A
= +25°C.)
= +25°C
= +85°C
CONDITIONS
REF
A
A
Operating Temperature Range ...........................-40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow)
36 WLP
REF
= +85°C
Junction-to-Ambient Thermal Resistance (θ
= +25°C
Junction-to-Case Thermal Resistance (θ
6 x 6 UCSP (derate 22mW/°C above +70°C) ...............1.75W
20-Pin 5mm x 5mm x 0.9mm TQFN (derate 20.8mW/°C
above +70°C) (Note 2)...................................................1.67W
36-Bump WLP (derate 22mW/°C above +70°C)............1.75W
Lead(Pb)-Free (TQFN, WLP)........................................+260°C
Containing Lead (UCSP)............................................. +240°C
= 10µA to 1mA
V
V
V
V
= 150µA
MAXI_
MAXI_
MAXI_
MAXI_
= V
= V
= V
= V
REF
REF
REF
REF
/3
/3
1.485
MIN
±1.5
140
143
3.0
40
45
1.500
TYP
0.09
0.11
0.14
0.17
0.03
0.03
150
150
1.2
0.3
0.3
50
50
JC
JA
)......................4°C/W
)..................38°C/W
1.515
MAX
0.14
0.16
0.23
0.30
4.00
4.00
160
155
5.5
5.0
60
55
UNITS
mV
mV
µA
µA
Ω
Ω
V
A
V