MAX6133BASA25-T Maxim Integrated Products, MAX6133BASA25-T Datasheet - Page 10
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MAX6133BASA25-T
Manufacturer Part Number
MAX6133BASA25-T
Description
Voltage & Current References
Manufacturer
Maxim Integrated Products
Datasheet
1.MAX6133A25.pdf
(13 pages)
Specifications of MAX6133BASA25-T
Product
Voltage References
Topology
Series References
Output Voltage
2.5 V
Initial Accuracy
0.08 %
Average Temperature Coefficient (typ)
5 PPM / C
Series Vref - Input Voltage (max)
13 V
Shunt Current (max)
15 mA
Maximum Operating Temperature
+ 125 C
Package / Case
SOIC-8 Narrow
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
3ppm/°C, Low-Power, Low-Dropout
Voltage Reference
For the best line-transient performance, decouple the
input with a 0.1µF ceramic capacitor as shown in the
Typical Operating Circuit. Place the capacitor as close
to IN as possible. When transient performance is less
important, no capacitor is necessary. The MAX6133
family requires a minimum output capacitance of 0.1µF
for stability and is stable with capacitive loads (includ-
ing the bypass capacitance) of up to 100µF. In applica-
tions where the load or the supply can experience step
changes, a larger output capacitor reduces the amount
of overshoot (undershoot) and improves the circuit’s
transient response. Place output capacitors as close to
the device as possible.
The quiescent supply current of the MAX6133 series
reference is typically 40µA and is virtually independent
of the supply voltage. In the MAX6133 family, the load
current is drawn from the input only when required, so
supply current is not wasted and efficiency is maxi-
mized at all input voltages. This improved efficiency
reduces power dissipation and extends battery life.
When the supply voltage is below the minimum-speci-
fied input voltage (as during turn-on), the devices can
draw up to 150µA beyond the nominal supply current.
The input voltage source must be capable of providing
this current to ensure reliable turn-on.
Thermal hysteresis is the change in the output voltage
at T
over its entire operating temperature range. Hysteresis
is caused by differential package stress appearing
across the bandgap core transistors. The typical ther-
mal hysteresis value is 120ppm for both SO and µMAX
packages.
10
A
______________________________________________________________________________________
= +25°C before and after the device is cycled
1, 3, 7
PIN
5, 8
2
4
6
Applications Information
Bypassing/Load Capacitance
NAME
GND
N.C.
OUT
Thermal Hysteresis
I.C.
IN
Supply Current
No Connection. Not connected internally. Leave unconnected or connect to GND.
Positive Power-Supply Input
Ground
Internally Connected. Do not connect externally.
Reference Output Voltage. Connect a 0.1µF minimum capacitor to GND.
These devices typically turn on and settle to within
0.01% of their final value in <1ms. The turn-on time can
increase up to 2ms with the device operating at the
minimum dropout voltage and the maximum load.
Figure 1 shows a typical application circuit for the
MAX6133 providing both the power supply and precision
reference voltage for a 14-bit high-resolution, serial-
input, voltage-output digital-to-analog converter. The
MAX6133 with a 2.5V output provides the reference volt-
age for the DAC.
Figure 1. 14-Bit High-Resolution DAC and Positive Reference
From a Single 3V Supply
MAX6133
FUNCTION
GND
IN
with MAX6133 as a Reference
OUT
3V SUPPLY
Low-Power, 14-Bit DAC
2.5V
Pin Description
REF
MAX5143
GND
V
DD
Turn-On Time
ANALOG
OUTPUT