MC3488AP1G ON Semiconductor, MC3488AP1G Datasheet - Page 5

IC DRIVER LINE DUAL SGL END 8DIP

MC3488AP1G

Manufacturer Part Number
MC3488AP1G
Description
IC DRIVER LINE DUAL SGL END 8DIP
Manufacturer
ON Semiconductor
Type
Driverr
Datasheet

Specifications of MC3488AP1G

Number Of Drivers/receivers
2/0
Protocol
RS232, RS423
Voltage - Supply
10.8 V ~ 13.2 V
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
Interface
EIA/TIA-232-D. EIA/TIA-423
Minimum Operating Temperature
0 C
Number Of Lines (input / Output)
/ /
Supply Current
18 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC3488AP1GOS
−Z−
−Y−
B
H
−X−
8
1
0.25 (0.010)
G
A
D
4
5
M
Z
S
Y
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
C
0.25 (0.010)
X
SEATING
PLANE
S
0.024
0.6
0.10 (0.004)
0.275
7.0
M
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
Y
PLASTIC PACKAGE
http://onsemi.com
M
N
CASE 751−07
X 45
SOIC−8 NB
MC3488A
D SUFFIX
ISSUE AH
_
M
5
K
SCALE 6:1
0.060
0.155
1.52
4.0
1.270
0.050
J
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751−07.
DIM
A
B
C
D
G
H
K
M
N
J
S
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
0.050 BSC
0
INCHES
_
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX
8
_

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