MAX3450EETE+ Maxim Integrated Products, MAX3450EETE+ Datasheet - Page 12

• Manufacturer Part Number: MAX3450EETE+
• Description: TXRX USB +/-15KV ESD PROT 16TQFN
• Manufacturer: Maxim Integrated Products
• Type: Transceiverr

Specifications of MAX3450EETE+

• Number Of Drivers/receivers: 1/1
• Protocol: USB 2.0
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Package / Case: 16-TQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

±15kV ESD-Protected USB Transceivers
D+ and D- possess extra protection against static elec-
tricity to protect the devices up to ±15kV. The ESD
structures withstand high ESD in all operating modes:
normal operation, suspend mode, and powered down.
D+ and D- provide protection to the following limits:
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents
test setup, test methodology, and test results.
Figure 7 shows the Human Body Model and Figure 8
shows the current waveform generated when dis-
charged into a low impedance. This model consists of a
100pF capacitor charged to the ESD voltage of interest,
which then discharges into the test device through a
1.5kΩ resistor.
The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment. It does not specifi-
cally refer to integrated circuits. The major difference
between tests done using the Human Body Model and
IEC 1000-4-2 is a higher peak current in IEC 1000-4-2,
due to lower series resistance. Hence, the ESD with-
stand voltage measured to IEC 1000-4-2 generally is
lower than that measured using the Human Body
Model. Figure 9 shows the IEC 1000-4-2 model. The
Contact Discharge method connects the probe to the
device before the probe is charged.
The Machine Model for ESD tests all connections using
a 200pF storage capacitor and zero discharge resis-
tance. Its objective is to emulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. All pins require this protection during
manufacturing, not just inputs and outputs. After PC
board assembly, the Machine Model is less relevant to
I/O ports.
• ±15kV using the Human Body Model
• ±8kV using the Contact Discharge method specified
12
in IEC 1000-4-2
______________________________________________________________________________________
ESD Test Conditions
Human Body Model
ESD Protection
Machine Model
IEC 1000-4-2
Figure 7. Human Body ESD Test Models
Figure 8. Human Body Model Current Waveform
Figure 9. IEC 1000-4-2 ESD Test Model
AMPERES
VOLTAGE
SOURCE
VOLTAGE
SOURCE
HIGH-
HIGH-
DC
DC
I
P
36.8%
100%
90%
10%
CHARGE-CURRENT-
CHARGE-CURRENT-
LIMIT RESISTOR
LIMIT RESISTOR
0
0
50Ω to 100Ω
1MΩ
R
t
R
C
RL
150pF
C
100pF
C s
C s
STORAGE
CAPACITOR
STORAGE
CAPACITOR
CURRENT WAVEFORM
RESISTANCE
RESISTANCE
DISCHARGE
TIME
DISCHARGE
330Ω
1.5kΩ
R
R
D
D
t
DL
I r
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
DEVICE
UNDER
DEVICE
UNDER
TEST
TEST