PIC32MX575F256HT-80V/MR Microchip Technology, PIC32MX575F256HT-80V/MR Datasheet - Page 213

• Manufacturer Part Number: PIC32MX575F256HT-80V/MR
• Description: 256 KB Flash, 64 KB RAM, USB-OTG, CAN, 80 MHz, 10-Bit ADC, DMA 64 QFN 9x9x0.9mm
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr

Specifications of PIC32MX575F256HT-80V/MR

• Core Processor: MIPS32® M4K™
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, I²C, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 64-VFQFN Exposed Pad
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TABLE 31-35: ETHERNET MODULE SPECIFICATIONS
© 2009-2011 Microchip Technology Inc.
AC CHARACTERISTICS
MIIM Timing Requirements
ET1
ET2
ET3
ET4
MII Timing Requirements
ET5
ET6
ET7
ET8
ET9
ET10
RMII Timing Requirements
ET11
ET12
ET13
ET14
Param.
No.
MDC Duty Cycle
MDC Period
MDIO Output Delay
MDIO Input Delay
TX Clock Frequency
TX Clock Duty Cycle
ETXDx, ETEN, ETXERR Delay
RX Clock Frequency
RX Clock Duty Cycle
ERXDx, ERXDV, ERXERR Delay
Reference Clock Frequency
Reference Clock Duty Cycle
ETXDx, ETEN, Delay
ERXDx, ERXDV, ERXERR Delay
Characteristic
Operating temperature
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Min.
400
40
10
35
35
10
35
—
—
—
0
0
2
2
Typical
25
25
—
50
—
—
—
—
—
—
—
—
—
—
PIC32MX5XX/6XX/7XX
-40°C ≤ T
-40°C ≤ T
Max.
300
10
65
30
65
16
60
—
—
65
25
—
—
16
A
A
≤ +85°C for Industrial
≤ +105°C for V-Temp
Units
MHz
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
%
%
%
%
DS61156G-page 213
Conditions
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