PIC32MX575F256L-80V/PT Microchip Technology, PIC32MX575F256L-80V/PT Datasheet - Page 185
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PIC32MX575F256L-80V/PT
Manufacturer Part Number
PIC32MX575F256L-80V/PT
Description
256 KB Flash, 64 KB RAM, USB-OTG, CAN, 80 MHz, 10-Bit ADC, DMA 100 TQFP 12x12x1m
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheet
1.PIC32MX575F256H-80VPT.pdf
(256 pages)
Specifications of PIC32MX575F256L-80V/PT
Core Processor
MIPS32® M4K™
Core Size
32-Bit
Speed
80MHz
Connectivity
CAN, I²C, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
100-TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
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TABLE 31-5:
© 2009-2011 Microchip Technology Inc.
DC CHARACTERISTICS
Operating Current (I
DC20
DC20b
DC20a
DC21
DC21a
DC22
DC22a
DC23
DC23b
DC23a
DC25a
Operating Current (I
DC20b
DC20c
DC21b
DC21c
DC22b
DC22c
DC23b
DC23c
DC25b
Note 1:
Param.
No.
2:
3:
4:
5:
Typical
A device’s I
such as PBCLK (Peripheral Bus Clock) frequency, number of peripheral modules enabled, internal code
execution pattern, execution from Program Flash memory vs. SRAM, I/O pin loading and switching rate,
oscillator type, as well as temperature, can have an impact on the current consumption.
The test conditions for I
external square wave from rail-to-rail and PBCLK divisor = 1:8. CPU, Program Flash and SRAM data
memory are operational, program Flash memory Wait states = 7, program cache and prefetch are dis-
abled and SRAM data memory Wait states = 1 . All peripheral modules are disabled (ON bit = 0 ). WDT
and FSCM are disabled. All I/O pins are configured as inputs and pulled to V
Data in “Typical” column is at 3.3V, 25°C at specified operating frequency unless otherwise stated.
Parameters are for design guidance only and are not tested.
This parameter is characterized, but not tested in manufacturing.
This information is preliminary.
125
100
37
25
64
61
85
90
85
19
14
31
29
39
39
6
7
4
6
2
(3)
DC CHARACTERISTICS: OPERATING CURRENT (I
DD
DD
DD
Max.
120
150
150
)
)
10
—
40
—
70
—
98
—
—
40
—
70
—
98
—
(1,2)
9
(1,2,5)
9
supply current is mainly a function of the operating voltage and frequency. Other factors,
for PIC32MX575/675/695/775 Family Devices
for PIC32MX534/564/664/764 Family Devices
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
Units
DD
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
µA
µA
measurements are as follows: Oscillator mode = EC+PLL with OSC1 driven by
Code executing from Flash
Code executing from SRAM
Code executing from Flash
Code executing from SRAM
Code executing from Flash
Code executing from SRAM
Code executing from Flash
Code executing from SRAM
Code executing from Flash
Code executing from SRAM
Code executing from Flash
Code executing from SRAM
Code executing from Flash
Code executing from SRAM
Code executing from Flash
Code executing from SRAM
—
—
-40°C ≤ T
-40°C ≤ T
PIC32MX5XX/6XX/7XX
A
A
≤ +85°C for Industrial
≤ +105°C for V-Temp
Conditions
+105ºC
+105ºC
+25ºC,
+25ºC,
-40ºC,
+85ºC
-40ºC,
+85ºC
+25°C
+25°C
DD
—
—
—
—
—
—
—
—
—
—
—
—
)
SS
3.3V
3.3V
—
—
—
—
—
—
—
—
—
—
—
—
. MCLR = V
DS61156G-page 185
LPRC (31 kHz)
LPRC (31 kHz)
DD
(Note 4)
(Note 4)
(Note 4)
(Note 4)
(Note 4)
(Note 4)
25 MHz
60 MHz
80 MHz
25 MHz
60 MHz
80 MHz
4 MHz
4 MHz
.
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