DS9638CN National Semiconductor, DS9638CN Datasheet - Page 2
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DS9638CN
Manufacturer Part Number
DS9638CN
Description
IC DRIVER DUAL HS DIFF 8-DIP
Manufacturer
National Semiconductor
Type
Driverr
Datasheet
1.DS9638CMNOPB.pdf
(6 pages)
Specifications of DS9638CN
Number Of Drivers/receivers
2/0
Protocol
RS422
Voltage - Supply
4.75 V ~ 5.25 V
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*DS9638CN
DS9638
DS9638
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DS9638CN
Manufacturer:
NSC
Quantity:
1 440
Part Number:
DS9638CN
Manufacturer:
NS/国半
Quantity:
20 000
www.national.com
V
V
V
V
V
I
I
I
I
V
V
V
V
I
I
I
IH
IL
OS
X
CC
IH
IL
IC
OH
OL
T
T
OS
OS
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Recommended Operating Conditions
Note 1: Derate cavity package 8.7 mW/˚C above 25˚C; derate molded DIP package 7.5 mW/˚C above 25˚C; derate SO package 6.5 mW˚C above 25˚C.
Electrical Characteristics
Over recommended operating temperature and supply voltage ranges, unless otherwise specified
Note 2: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The tables of “Electrical Characteristics provide conditions for actual device operation.
Note 3: Unless otherwise specified min/max limits apply across the −55˚C to +125˚C temperature range for the DS9638M and across the 0˚C to +70˚C range for
the DS9638C. All typicals are given for V
Note 4: All currents into the device pins are positive; all currents out of the device pins are negative. All voltages are referenced to ground unless otherwise
specified.
Note 5: Only one output at a time should be shorted.
Symbol
Storage Temperature Range
Lead Temperature
, V
–V
, V
–V
Ceramic DIP
Molded DIP and SO-8
T
T
OS
OS
Input Voltage HIGH
Input Voltage LOW
Input Clamp Voltage
Output Voltage HIGH
Output Voltage LOW
Input Current at Maximum
Input Voltage
Input Current HIGH
Input Current LOW
Output Short Circuit Current
Terminated Output Voltage
Output Balance
Output Offset Voltage
Output Offset Balance
Output Leakage Current
Supply Current
(Both Drivers)
Supply Voltage (V
Output Current HIGH (I
Output Current LOW (I
Operating Temperature (T
Parameter
CC
= 5V and T
CC
)
OL
OH
(Notes 3, 4)
A
)
)
A
= 25˚C.
)
(Note 2)
0˚C to +70˚C
−55˚C to +125˚C
V
V
V
V
V
V
V
V
V
V
See Figure 1
T
−0.25V
V
All input at 0V,
No Load
−65˚C to
−65˚C to
CC
IH
IL
CC
+175˚C
+150˚C
A
CC
CC
IL
CC
CC
CC
CC
Min
−55
4.5
= V
= V
= 25˚C
= V
= Min,
= 5.5V,
= Min, I
= Min, V
= Max, V
= Max, V
= Max, V
= Max, V
IL Max
IH Min
DS9638M
IL Max
<
V
Typ
5.0
25
X
,
I
, I
2
Conditions
IH
<
= −18 mA
I Max
IH
IL
O
OL
= V
5.5V
= 0V (Note 4)
= 0.5V
= 2.7V
Max
−50
125
= 40 mA
Maximum Power Dissipation (Note 1) at 25˚C
V
Input Voltage
5.5
50
= 5.5V
IH Min
CC
Ceramic DIP (Soldering, 60 sec.)
Molded DIP (Soldering, 10 sec.)
Cavity Package
Molded Package
SO Package
I
I
OH
OH
Lead Potential to Ground
,
= −10 mA
= −40 mA
4.75
Min
40
0
DS9638C
Typ
5.0
25
Min
−50
2.0
2.5
2.0
2.0
Max
5.25
−50
50
70
−1.0
Units
Typ
3.5
45
mA
mA
˚C
V
−200
−150
Max
−1.2
100
0.8
0.5
0.5
0.4
3.0
0.4
50
25
65
−0.5V to +7V
−5V to 7V
1300 mW
930 mW
810 mW
300˚C
265˚C
Units
mA
mA
µA
µA
µA
µA
V
V
V
V
V
V
V
V
V