MCP2120-I/P Microchip Technology, MCP2120-I/P Datasheet - Page 29

IC ENCODER/DECODR INFRARED 14DIP

MCP2120-I/P

Manufacturer Part Number
MCP2120-I/P
Description
IC ENCODER/DECODR INFRARED 14DIP
Manufacturer
Microchip Technology
Type
Infrared Encoder/Decoderr
Datasheets

Specifications of MCP2120-I/P

Package / Case
14-DIP (0.300", 7.62mm)
Voltage - Supply, Analog
2.5 V ~ 5.5 V
Voltage - Supply, Digital
2.5 V ~ 5.5 V
Mounting Type
Through Hole
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Ic Function
Infrared Encoder/Decoder
Supply Voltage Range
2.5V To 5.5V
Operating Temperature Range
-40°C To +85°C
Digital Ic Case Style
DIP
No. Of Pins
14
Leaded Process Compatible
No
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP212XDM - BOARD DEVELOPMENT IRDA
Applications
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP2120-I/P
Manufacturer:
ROHM
Quantity:
1 400
Part Number:
MCP2120-I/P
Quantity:
22
Part Number:
MCP2120-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2007 Microchip Technology Inc.
14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
1
N
2
b
3
D
Dimension Limits
e
Units
A2
A1
E1
L1
E1
D
N
A
E
α
e
h
L
φ
c
b
β
A2
E
1.25
0.10
0.25
0.40
0.17
0.31
MIN
φ
L
MILLMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
8.65 BSC
1.04 REF
L1
NOM
14
Microchip Technology Drawing C04-065B
h
MAX
β
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
MCP2120
α
DS21618B-page 29
c

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