MCP23S17-E/SS Microchip Technology, MCP23S17-E/SS Datasheet - Page 38
![IC I/O EXPANDER SPI 16B 28SSOP](/photos/6/81/68119/150-28-ssop_sml.jpg)
MCP23S17-E/SS
Manufacturer Part Number
MCP23S17-E/SS
Description
IC I/O EXPANDER SPI 16B 28SSOP
Manufacturer
Microchip Technology
Datasheet
1.MCP23S17-ESP.pdf
(48 pages)
Specifications of MCP23S17-E/SS
Package / Case
28-SSOP
Interface
SPI
Number Of I /o
16
Interrupt Output
Yes
Frequency - Clock
10MHz
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
MCP23S17
Propagation Delay Time
50 ns
Operating Supply Voltage
1.8 V to 5.5 V
Power Dissipation
700 mW
Operating Temperature Range
- 40 C to + 125 C
Input Voltage
1.8 V to 5.5 V
Logic Type
I/O Expander
Maximum Clock Frequency
10 MHz
Maximum Operating Frequency
1.7 MHz
Mounting Style
SMD/SMT
Output Current
25 mA
Output Voltage
1.8 V to 4.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP23X17EV - BOARD EVAL FOR MCP23X17GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP23S17-E/SS
Manufacturer:
HIROSE
Quantity:
560
Part Number:
MCP23S17-E/SS
Manufacturer:
MICROCHIP
Quantity:
20 000
MCP23017/MCP23S17
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS21952B-page 38
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Units
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
e
1.345
.120
.015
.290
.240
.110
.008
.040
.014
A2
MIN
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.310
.285
.130
.010
.050
.018
.135
28
–
–
–
Microchip Technology Drawing C04-070B
© 2007 Microchip Technology Inc.
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
c