293D337X9010E2T Vishay, 293D337X9010E2T Datasheet - Page 11

• Manufacturer Part Number: 293D337X9010E2T
• Description: Tantalum Capacitors - Solid SMD 330uF 10volts 10% E case
• Manufacturer: Vishay
• Series: 293Dr

Specifications of 293D337X9010E2T

• Capacitance: 330 uF
• Voltage Rating: 10 Volts
• Esr: 0.5 Ohms
• Tolerance: 10 %
• Operating Temperature Range: - 55 C to + 85 C
• Package / Case: 7343-43 metric
• Dimensions: 4.3 mm W x 7.3 mm L
• Height: 4 mm
• Mfr Case Code: E Case
• Product: Tantalum Solid Low ESR Commercial Grade
• Dissipation Factor Df: 10
• Lead Spacing: 1.3 mm
• Leakage Current: 33 uAmps
• Ripple Current: 0.57 Amp
• Termination Style: SMD/SMT
• Lead Free Status / Rohs Status: No RoHS Version Available

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11
293D
Vishay Sprague
GUIDE TO APPLICATION
3.
3.1
3.2
4.
5.
6.
A-C Ripple Voltage: The maximum allowable ripple
voltage shall be determined from the formula:
or, from the formula:
where,
P =
R
Z =
The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at + 25 °C.
Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating at + 25 °C, 5 % of the
DC rating at + 85 °C and 1 % of the DC rating at
+ 125 °C.
Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent I
when calculating permissible operating levels. (Power
Dissipation calculated using + 25 °C temperature
rise.)
ESR
Temperature
Case Code
+ 125 °C
+ 25 °C
+ 85 °C
=
V
A
B
C
D
E
V
rms
rms
Power Dissipation in Watts at + 25 °C as
given in the table in Paragraph Number 5
(Power Dissipation).
The capacitor Equivalent Series
Resistance at the specified frequency.
The capacitor impedance at the specified
frequency.
=
=
Z
I
rms
--------------- -
R
ESR
P
×
Z
+ 25 °C (Watts) in free air
Maximum Permissible
(Continued)
Power Dissipation at
rms
TANTAMOUNT®, Commercial, Surface Mount
Derating Factor
For technical questions, contact: [e-mail]
value be established
0.075
0.085
0.110
0.150
0.165
1.0
0.9
0.4
Solid Tantalum Chip Capacitors
7.
8.
8.1
8.2
8.2.1 Backward and Forward Compatibility: Capacitors
9.
9.1
Printed Circuit Board Materials: Type 293D
capacitors are compatible with commonly used
printed circuit board materials (alumina substrates,
FR4, FR5, G10, PTFE-fluorocarbon and porcelanized
steel).
Attachment:
Solder Paste: The recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
In practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
Soldering:
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering and
hot plate methods. The Soldering Profile charts show
recommended
soldering.
recommended maximum ramp rate is 2 °C per
second. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
with SnPb or 100% tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
Cleaning (Flux Removal) After Soldering: The
293D is compatible with all commonly used solvents
such as TES, TMS, Prelete, Chlorethane, Terpene
and aqueous cleaning media. However, CFC/ODS
products are not used in the production of these
devices and are not recommended. Solvents
containing methylene chloride or other epoxy
solvents should be avoided since these will attack the
epoxy encapsulation material.
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This vibration
can cause cracking or a decrease in the adherence of
the termination. DO NOT EXCEED 9W/l @ 40 kHz for
2 minutes.
Preheating
Capacitors
time/temperature
is
can
Document Number: 40002
recommended.
be
Revision: 25-Apr-05
conditions
attached
The
for
by