MCP23008-E/SO Microchip Technology, MCP23008-E/SO Datasheet - Page 37
![IC I/O EXPANDER I2C 8B 18SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
MCP23008-E/SO
Manufacturer Part Number
MCP23008-E/SO
Description
IC I/O EXPANDER I2C 8B 18SOIC
Manufacturer
Microchip Technology
Specifications of MCP23008-E/SO
Package / Case
18-SOIC (7.5mm Width)
Interface
I²C
Number Of I /o
8
Interrupt Output
Yes
Frequency - Clock
1.7MHz
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Includes
POR
Logic Family
MCP23008
Propagation Delay Time
50 ns
Operating Supply Voltage
1.8 V to 5.5 V
Power Dissipation
700 mW
Operating Temperature Range
- 40 C to + 125 C
Input Voltage
1.8 V to 5.5 V
Logic Type
I/O Expander
Maximum Clock Frequency
10 MHz
Maximum Operating Frequency
1.7 MHz
Mounting Style
SMD/SMT
Output Current
25 mA
Output Voltage
1.8 V to 4.5 V
Chip Configuration
8 Bit
Bus Frequency
1.7MHz
Ic Interface Type
I2C, Serial
No. Of I/o's
8
Supply Voltage Range
1.8V To 5.5V
Digital Ic Case Style
SOIC
No. Of Pins
18
Delay Time
50ns
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP23008-E/SO
Manufacturer:
MICROCHIP
Quantity:
8 700
Part Number:
MCP23008-E/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2007 Microchip Technology Inc.
20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
A2
E1
Units
A2
A1
E1
L1
D
N
A
E
e
L
c
b
MCP23008/MCP23S08
E
c
MIN
1.65
0.05
7.40
5.00
6.90
0.55
0.09
0.22
0°
–
L1
MILLIMETERS
0.65 BSC
1.25 REF
NOM
1.75
7.80
5.30
7.20
0.75
20
4°
–
–
–
–
Microchip Technology Drawing C04-072B
MAX
2.00
1.85
8.20
5.60
7.50
0.95
0.25
0.38
8°
–
DS21919E-page 37
L