LTC4311CSC6#TRPBF Linear Technology, LTC4311CSC6#TRPBF Datasheet - Page 11

• Manufacturer Part Number: LTC4311CSC6#TRPBF
• Description: IC ACCELERATOR SMBUS DL SC70-6
• Manufacturer: Linear Technology
• Type: Acceleratorr

Specifications of LTC4311CSC6#TRPBF

• Tx/rx Type: I²C Logic
• Voltage - Supply: 1.6 V ~ 5.5 V
• Current - Supply: 300µA
• Mounting Type: Surface Mount
• Package / Case: SC-70-6, SC-88, SOT-363
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Delay Time: -
• Capacitance - Input: -

PACKAGE DESCRIPTION
2.50 ±0.05
GAUGE PLANE
1.15 ±0.05
0.15 BSC
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
M0-229 VARIATION OF (WCCD-2)
2.8 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.61 ±0.05
(2 SIDES)
0.10 – 0.40
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
1.8 REF
RECOMMENDED SOLDER PAD LAYOUT
MAX
0.47
PER IPC CALCULATOR
1.42 ±0.05
(2 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.26 – 0.46
0.50 BSC
0.65
REF
0.25 ± 0.05
0.675 ±0.05
PACKAGE
OUTLINE
(Reference LTC DWG # 05-08-1638 Rev B)
1.00 REF
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
(SEE NOTE 6)
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.10 – 0.18
(NOTE 3)
TOP MARK
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
PIN 1 BAR
6-Lead Plastic SC70
0.200 REF
SC6 Package
DC Package
1.80 – 2.40
1.00 MAX
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. DETAILS OF THE PIN 1 IDENTIFIER ARE OPTIONAL,
7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70
8. JEDEC PACKAGE REFERENCE IS MO-203 VARIATION AB
1.15 – 1.35
(NOTE 4)
BUT MUST BE LOCATED WITHIN THE INDEX AREA
0.80 – 1.00
0.75 ±0.05
0.65 BSC
PIN 1
2.00 ±0.10
(4 SIDES)
0.00 – 0.05
INDEX AREA
(NOTE 6)
0.56 ± 0.05
(2 SIDES)
1.80 – 2.20
(NOTE 4)
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
1.37 ±0.05
(2 SIDES)
3
4
6
1
0.50 BSC
SC6 SC70 1205 REV B
0.00 – 0.10
0.15 – 0.30
6 PLCS (NOTE 3)
0.38 ± 0.05
LTC4311
0.25 ± 0.05
REF
PIN 1
CHAMFER OF
EXPOSED PAD
(DC6) DFN 1103
11
4311fa