533082-1 TE Connectivity, 533082-1 Datasheet - Page 3
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533082-1
Manufacturer Part Number
533082-1
Description
High Speed / Modular Connectors .100 ACC GUIDE PIN
Manufacturer
TE Connectivity
Series
AMP-HDI Seriesr
Specifications of 533082-1
Number Of Positions / Contacts
4
Termination Style
Screw
Contact Material
Brass
Contact Plating
Unplated
Product Type
Contact
Pcb Mount Retention
Without
Thread Length (mm [in])
9.52 [0.375]
Contact Type
Pin
Contact Plating, Mating Area, Material
Unplated
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Lead Free Status / Rohs Status
Details
Unm ating force.
Contact retention.
Contact engaging force.
Contact separating force.
Durability.
Resistance to soldering heat.
Insertion force, ACTION PIN.
Retention force, ACTION PIN.
Torque, ACTION PIN.
Therm al shock.
Hum idity-tem perature cycling.
Rev C
Test Description
No physical dam age.
40 pounds m axim um per pin.
Pin shall not dislodge from printed
.4 ounces m inim um average per
contact.
Contacts shall not dislodge from its
norm al locking position.
4 ounces m axim um per contact.
.1 ounce m inim um .
No physical dam age.
.020 ohm s m axim um term ination
resistance, low level.
Contact separation force.
wiring board.
Pin shall not m ove or dislodge from
printed wiring board.
.020 ohm s m axim um term ination
resistance, low level.
1000 m egohm s final insulation
resistance.
ENVIRONMENTAL
Figure 1 (end)
Requirem ent
Measure force to engage using
Size 3 tim es using gage 2, insert
Subject term inal posts m ounted on
Fully insert pin into printed wiring
Measure force necessary to unm ate
connector assem bly.
Calculate force per contact.
TE Spec 109-42, Condition A.
Apply axial load of 3 pounds to
individual contacts.
TE Spec 109-30.
gage 2.
See Figure 4.
TE Spec 109-35.
gage 1 and m easure force to
separate.
See Figure 4.
TE Spec 109-35.
Mate and unm ate pin and
receptacle connectors for 250
cycles.
TE Spec 109-27.
printed circuit boards to solder bath
at 260 ±5 C for 10 ±2 seconds.
Spec 109-63-3.
board hole.
Apply an axial load of 10 pounds for
10 seconds.
Apply 2 inch ounces for 10 seconds
in both directions.
Subject m ated connectors to 5
cycles between -65 and 125°C.
TE Spec 109-22.
Subject m ated connectors to 10
hum idity-tem perature cycles
between 25 and 65°C at 95% RH.
TE Spec 109-23, Method III,
Condition B, less steps 7 a and 7b.
Procedure
108-9063
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