UJA1069TW24/3V0:51 NXP Semiconductors, UJA1069TW24/3V0:51 Datasheet - Page 2

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UJA1069TW24/3V0:51

Manufacturer Part Number
UJA1069TW24/3V0:51
Description
IC LIN FAIL-SAFE 24-HTSSOP
Manufacturer
NXP Semiconductors
Datasheet

Specifications of UJA1069TW24/3V0:51

Applications
Automotive
Interface
LIN (Local Interconnect Network)
Voltage - Supply
3V
Package / Case
24-TSSOP Exposed Pad, 24-eTSSOP, 24-HTSSOP
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935280016512
UJA1069TW24/3V0
UJA1069TW24/3V0
NXP Semiconductors
2. Features
UJA1069_3
Product data sheet
2.1 General
2.2 LIN transceiver
2.3 Power management
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Contains a full set of LIN ECU functions:
Designed for automotive applications:
Supports remote flash programming via the LIN-bus
Available in:
LIN 2.0 and SAE J2602 compliant LIN transceiver
Enhanced error signalling and reporting
Downward compatible with LIN 1.3 and the TJA1020
Smart operating modes and power management modes
Cyclic wake-up capability in Standby and Sleep mode
Local wake-up input with cyclic supply feature
Remote wake-up capability via the LIN-bus
External voltage regulators can easily be incorporated in the power supply system
(flexible and fail-safe)
42 V battery related high-side switch for driving external loads such as relays and
wake-up switches
Intelligent maskable interrupt output
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LIN transceiver
Voltage regulator for the microcontroller (3.0 V, 3.3 V or 5.0 V)
Enhanced window watchdog with on-chip oscillator
Serial Peripheral Interface (SPI) for the microcontroller
ECU power management system
Fully integrated autonomous fail-safe system
Supports 14 V and 42 V architectures
Excellent ElectroMagnetic Compatibility (EMC) performance
off-board pins
Battery and LIN-bus pins are protected against transients in accordance with
ISO 7637-3
Very low sleep current
Small 6.4 mm
Small 8 mm
8 kV ElectroStatic Discharge (ESD) protection Human Body Model (HBM) for
4 kV ElectroStatic Discharge (ESD) protection IEC 61000-4-2 for off-board pins
60 V short-circuit proof LIN-bus pin
Rev. 03 — 10 September 2007
11 mm HTSSOP32 package with low thermal resistance
7.8 mm HTSSOP24 package with low thermal resistance
LIN fail-safe system basis chip
UJA1069
© NXP B.V. 2007. All rights reserved.
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