SPEG110100 ALPS, SPEG110100 Datasheet - Page 4

• Manufacturer Part Number: SPEG110100
• Description: Pushbutton Switches HOLLOW SLIDER PUSH BUTTON 1.1MM W/ GRND
• Manufacturer: ALPS

Specifications of SPEG110100

• Lead Free Status / Rohs Status: Details

Detector
Push
Slide
Rotary
Encoders
Power
Dual-in-line
Package Type
TACT Switch
Custom-
Products
Horizontal
Type
Vertical
Type
108
Push Switches
TM
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape
3. Temperature profile
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
Series （ Reflow type）
Soldering Conditions
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
highly recommended.
SPEF, SPEG
SPEE
Room
temperature
300
200
100
should be used for fixed measurement.
3s max.
A （℃）
260
Pre-heating
F max.
B （℃）
230
C （s）
40
C
D （℃）
180
A max.
B
D
E
E （℃）
150
Time (s)
F （s）
120