EA-OEM-509 Embedded Artists, EA-OEM-509 Datasheet - Page 107

• Manufacturer Part Number: EA-OEM-509
• Description: KIT DEV LPC1788-32
• Manufacturer: Embedded Artists

Specifications of EA-OEM-509

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

NXP Semiconductors
Fig 44. TFBGA180 package
LPC178X_7X
Objective data sheet
TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT570-2
ball A1
index area
ball A1
index area
max.
1.2
A
0.35
0.25
A
P
N
M
K
H
G
E
D
C
B
A
1
L
J
F
0.85
0.75
1
A
2
2
e
IEC
3
0.5
0.4
b
4
5
12.2
11.8
6
D
7
e
D
1
12.2
11.8
8
E
All information provided in this document is subject to legal disclaimers.
9
1/2 e
JEDEC
10
0.8
0
11
e
REFERENCES
12
b
10.4
Rev. 2 — 27 May 2011
13 14
e
1
10.4
e
1/2 e
2
JEITA
scale
B
e
5
∅ w
∅ v
0.15
e
A
v
E
2
M
M
C
C
0.08
w
A
B
0.12
y
10 mm
A
32-bit ARM Cortex-M3 microcontroller
A
0.1
y
2
1
y
1
A
C
1
PROJECTION
EUROPEAN
detail X
LPC178x/7x
C
X
y
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
03-03-03
06-03-14
SOT570-2
107 of 117