ZICM0900P2-KIT1-1 CEL, ZICM0900P2-KIT1-1 Datasheet

no-image

ZICM0900P2-KIT1-1

Manufacturer Part Number
ZICM0900P2-KIT1-1
Description
RF EVAL FOR ZICM0900P2
Manufacturer
CEL
Series
MeshConnect™r
Type
Transceiver, ISMr

Specifications of ZICM0900P2-KIT1-1

Frequency
900MHz
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
ZICM0900P2
DESCRIPTION
CEL's MeshConnect™ Sub-G modules are built on the Si1000
and Si1002 highly integrated wireless SoC's from Silicon Labs.
Targeting dense operating environments, CEL’s MeshConnect
Sub-G modules deliver superior range and performance. Their
low power consumption enables longer battery life and their link
budgets provide reliable transmission in non line of sight ap-
plications such as lighting control, industrial sensor networks,
serial wire replacement, metering, irrigation and more. At +13
and +20 dBm power outputs, the new Sub-G modules offer 868
MHz (Europe) and 915 MHz (Americas) ISM band options. As
certified and qualified modules, the MeshConnect Sub-G solu-
tions eliminate the need for costly certifications, reducing overall
system cost and accelerating time to market.
APPLICATIONS
• Lighting Control
• Irrigation
• Serial wire replacement
• Industrial Sensor Networks
• Wireless M-Bus Metering
• Home Automation & Smart Plugs
• Security
• And more...
The information in this document is subject to change without notice, please confirm data is current
Document No: 0009-00-07-00-000 (Issue ES)
Date Published: June 10, 2011
868 / 900 MHz System-on-Chip (SoC) Based Modules
PRELIMINARY DATA SHEET
MeshConnect™ Sub-G Module Series
ZICM0868P0-KIT1-1 and ZICM0900P2-KIT1-1
FEATURES
• Frequency Range:
• Link Budget up to -140 dB
• Max Output Power:
• Data Rate: 0.123 to 150 kbps
• General Purpose I/Os: 21
• High Speed 8051 MCU:
• 10-Bit ADC:
• Serial Communication:
• Add 1MB additional Flash memory
902- 928 MHz
868 MHz
(for +20 dBm module)
+20 dBm and +13 dBm available
output powers
+ 13 dBm @ 3.5 V
+ 20 dBm @ 3.5 V
25 MHz - single cycle instruction execution
4kB RAM / 64 kB Flash
300 ksps, 18-ch inputs
UARTs, SPI (Master/Slave)
SMBus, PCA
to enable Over The Air (OTA)
programming
• Long Range
• Low Power Consumption
• 868 and 900 MHz Frequency Ranges
• 1MB additional Flash Memory option enables
Over the Air (OTA) Programming
ZICM0868P0
(Optional)
DC
DC
MeshConnect
(ZICM0868P0)
Development Kits Available:
(ZICM0900P2)
• Modulation:
• RF Power Consumption
• Sleep Current 1.2 µA TYP
• Up to 6 miles of range
• Operating Temperature Range:
•Software Platforms:
• FCC, CE and IC certifications in
• ROHS compliant
FSK, GFSK, OOK
24 mA Receive
18 mA @ + 1 dBm transmit
42 mA @ + 13 dBm transmit
97 mA @ + 19 dBm transmit
(line of sight)
-40 to +85ºC
Synapse SNAP Embedded Firmware
Wireless M-Bus (868 MHz Only)
CEL Application Programming
Interface (API)
Silicon Labs EZMac
Progress
Multiple antenna options
FSK Modulation Only
Sub-G Modules
ZICM0868P0
ZICM0900P2
ZICM0900P2
Page 1

Related parts for ZICM0900P2-KIT1-1

ZICM0900P2-KIT1-1 Summary of contents

Page 1

... Document No: 0009-00-07-00-000 (Issue ES) Date Published: June 10, 2011 PRELIMINARY DATA SHEET MeshConnect™ Sub-G Module Series 868 / 900 MHz System-on-Chip (SoC) Based Modules ZICM0868P0-KIT1-1 and ZICM0900P2-KIT1-1 MeshConnect ZICM0868P0 • Long Range • Low Power Consumption • 868 and 900 MHz Frequency Ranges • ...

Page 2

... ZICM0900P2-1CS-SN ZICM0900P2-1C-SN ZICM0868P0-KIT1-1 MeshConnect™ Sub-G Development Kits ZICM0900P2-KIT1-1 MeshConnect™ Sub-G Module Series Description 868 MHz Module, +13dBm SoC with U.FL connector for external antenna 868 MHz Module, +13dBm SoC with RP-SMA connector for external antenna 868 MHz Module, +13dBm SoC with 1/4 wave wire antenna 900 MHz Module, +20dBm SoC with U ...

Page 3

... CEL’s website: www.cel.com/MeshConnect) DEVELOPMENT KIT ORDERING INFORMATION Part Number Order Number ZICM0868P0-KIT1-1 MeshConnect™ Sub-G Development Kits ZICM0900P2-KIT1-1 MeshConnect™ Sub-G Module Series ANT MeshConnect Sub-G Module Development Kit Kit Contents: • Evaluation Boards (2) • MeshConnect Sub-G Modules w/Daughter Cards (2) ...

Page 4

TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. Features.................................................................................................................................................................................................. Applications............................................................................................................................................................................................ Ordering Information............................................................................................................................................................................. Module Block Diagram........................................................................................................................................................................... Development Kit..................................................................................................................................................................................... System Level Function Transceiver IC......................................................................................................................................................................................... Antenna................................................................................................................................................................................................... Additional Flash Memory....................................................................................................................................................................... Electrical Specification Absolute Maximum Ratings................................................................................................................................................................... Recommended (Operating Condition).................................................................................................................................................. DC Characteristics.................................................................................................................................................................................. RF Characteristics.................................................................................................................................................................................. Pin Signal & Interfaces Pin Signals I/O Configuration................................................................................................................................................................ I/O Pin Assignment................................................................................................................................................................................. ...

Page 5

... For more information about the Silicon Labs ICs, visit http://www.silabs.com. ANTENNA The MeshConnect Sub-G modules include RF connectors for external antenna options only (There is no trace antenna option). The following options are supported by CEL: • U.FL connector to support cabled antenna • ...

Page 6

... Exceeding the maximum ratings may cause permanent damage to the module or devices. RECOMMENDED (OPERATING CONDITIONS) Description Power Supply Voltage ( Frequency Range (ZICM0868P0) Frequency Range (ZICM0900P2) Ambient Temperature Range Note: * 2.7v is the min voltage if an additional memory IC was ordered. DC CHARACTERISTICS (@ 25°C, V Description Transmit Mode Current (@ 13dBm) ...

Page 7

... Min Typ Max 865 – 870 – 13 – – -12 – – 15 – – 75 – – -99 – – – 3.5V, ZICM0900P2) DD MeshConnect™ Sub-G Module Min Typ Max 902 – 928 – 19 – – -5 – – 15 – – 75 – – -99 – – ...

Page 8

... P0.4/TXD Module's UART TXD 16 WP Write Protect Pin of Memory Chip on Module GND 19 GND P0.3 Used as Chip Select for Memory IC on the CEL Module 24 P0.2 Memory IC MISO signal pin 25 P0.1 Connected to NIRQ 26 P0.0 Memory IC Clock Signal 27 GND 28 VCC 29 RST/C2CK Debug Clock 30 P2.7/C2D Debug Data 31 P2 ...

Page 9

... GND 55 GND 56 GND Note: The CEL Sub G module has internal connections between Castellation Pins 12 & 49 and 25 & allow stand alone operation with both SNAP and CEL firmware images. SOFTWARE/FIRMWARE The Sub-G modules support the following software: • Synapse SNAP Embedded Firmware • ...

Page 10

SOFTWARE/FIRMWARE (Continued) • Self Healing (Orphan handling) • Point-to-Point network formation • Point-to-Multipoint (Star) network formation • Mesh network formation* • ACK • Wakeup Modes (Si100X) • Frequency Hopping • Unicast Addressing using 16-bit device IDs • Broadcast Addressing • ...

Page 11

... EVALUATION BOARD CEL provides an Evaluation board to allow easy testing of the Module. The Evaluation board provides power via: • AA cell batteries • USB • AC Adapter regulated down to 3.3VDC • External Lab Power Supply (A jumper is also provided for the purposes of monitoring the DC current of the module under various modes of operation) ...

Page 12

PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) Minimum Soak Temperature Maximum Soak Temperature Soak Time TLiquidus Time above TL Tpeak Time within 5º of Tpeak Time from 25º to Tpeak Ramp down rate Pb-Free Solder Paste ...

Page 13

... This device must accept any interference received, including interference that may cause undesired operation. Warning (Part 15.21) Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment Separation Distance To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter ...

Page 14

AGENCY CERTIFICATIONS (Continued) IC Certification — Industry Canada Statement The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications were met. This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two con- ...

Page 15

... CEL conducts 100% RF and DC factory testing on all production parts and also conducts sample testing on all device lots. CEL’s builds the quality into our products giving our customers the confidence when integrating our products into their systems. MeshConnect™ Sub-G Module Series ...

Page 16

... CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. • ...

Related keywords