MMA2201DR2 Freescale Semiconductor, MMA2201DR2 Datasheet - Page 7

• Manufacturer Part Number: MMA2201DR2
• Description: IC ACCELEROMETER 16-SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MMA2201DR2

• Lead Free Status / Rohs Status: Contains lead / RoHS non-compliant

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct footprint,
Motorola Sensor Device Data
Surface mount board layout is a critical portion of the total
T
0.1
SEATING
PLANE
B
B
C
16
K
1
G/2
16X
A
D
0.13
Freescale Semiconductor, Inc.
G
M
For More Information On This Product,
8
9
T
A
P
A
0.080 in.
2.03 mm
2 PLACES, 16 TIPS
B
Go to: www.freescale.com
Figure 5. Footprint SOIC-16 (Case 475-01)
0.15
PACKAGE DIMENSIONS
J
CASE 475-01
T
A
0.380 in.
9.65 mm
ISSUE B
16 LEAD SOIC
CASE 475-01
B
ISSUE B
F
R
X 45˚
the packages will self-align when subjected to a solder reflow
process. It is always recommended to design boards with a
solder mask layer to avoid bridging and shorting between solder
pads.
M
0.050 in.
1.27 mm
0.024 in.
0.610 mm
NOTES:
1.
2.
3.
4.
ALL DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
DIMENSIONS "A" AND "B" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
PER SIDE.
DIMENSION "D" DOES NOT INCLUDE DAMBAR
PROTRUSION. PROTRUSIONS SHALL NOT
CAUSE THE LEAD WIDTH TO EXCEED 0.75.
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
10.15
10.16
MIN
7.40
3.30
0.35
0.76
0.25
0.10
0.25
0˚
1.27 BSC
MAX
10.45
10.67
7.60
3.55
0.49
1.14
0.32
0.25
0.75
7˚
DATE 05/17/01
MMA2201D
7