IP4264CZ8-20-TTL,1 NXP Semiconductors, IP4264CZ8-20-TTL,1 Datasheet - Page 9
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IP4264CZ8-20-TTL,1
Manufacturer Part Number
IP4264CZ8-20-TTL,1
Description
Manufacturer
NXP Semiconductors
Datasheet
1.IP4264CZ8-20-TTL1.pdf
(15 pages)
Specifications of IP4264CZ8-20-TTL,1
Lead Free Status / Rohs Status
Compliant
NXP Semiconductors
IP4264CZ8-10_20_40-TTL
Product data sheet
7.3 USIM and SIM interface application schematic
The application schematic diagram depicted in
NXP SIM card EMI filter and ESD protection devices are used in a typical USIM interface
application.
For example, in case a standard SIM interface without USB 1.1 is used, the two single
diodes (pins 4 and 5) can protect the VSIM line.
It is only one example dependent on layout constraints. For example, channels 1 to 8 can
be swapped with channels 3 to 6.
Also, the USB interface ESD protection pins 4 and 5 can be exchanged. Due to both sides
of the devices containing identical protection diodes, baseband and SIM card side can be
swapped, too (pin 1 with pin 8, pin 2 with pin 7 etc.).
A standard SIM interface application is depicted in
ESD protection diodes (pins 1 and 8) are used to protect VSIM.
Fig 9.
BASEBAND
USB
USIM application schematic
VSIM
RST
CLK
D+
D–
I/O
All information provided in this document is subject to legal disclaimers.
1
2
3
4
Integrated (U)SIM card passive filter array with ESD protection
Rev. 1 — 8 July 2011
IP4264CZ8-10/20/40-TTL
100 Ω
100 Ω
47 Ω
R3
R2
R1
CENTER GROUND PAD
Figure 9
Figure
protection
diode
VSIM
demonstrates how the three
10. In this case, both
8
7
6
5
AUX 1 AUX 2
© NXP B.V. 2011. All rights reserved.
VCC
RST
CLK
SIM CARD
018aaa147
GND
SPU
I/O
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