LFEC3E-3TN100C Lattice, LFEC3E-3TN100C Datasheet - Page 146

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LFEC3E-3TN100C

Manufacturer Part Number
LFEC3E-3TN100C
Description
IC FPGA 3.1KLUTS 67I/O 100-TQFP
Manufacturer
Lattice
Datasheet

Specifications of LFEC3E-3TN100C

Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LFEC3E-3TN100C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Pinout Information
Lattice Semiconductor
LatticeECP/EC Family Data Sheet
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following located on the Lattice website at
www.latticesemi.com.
• Thermal Management document
• Technical Note TN1052 - Power Estimation and Management for LatticeECP/EC and LatticeXP Devices
• Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from
www.latticesemi.com/software
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