LFXP3C-3T100C Lattice, LFXP3C-3T100C Datasheet - Page 388
LFXP3C-3T100C
Manufacturer Part Number
LFXP3C-3T100C
Description
IC FPGA 3.1KLUTS 62I/O 100-TQFP
Manufacturer
Lattice
Datasheet
1.LFXP3C-3T100C.pdf
(397 pages)
Specifications of LFXP3C-3T100C
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP3C-3T100C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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PCB Layout Recommendations
Lattice Semiconductor
for BGA Packages
Figure 14-11. CAM Artwork Screen Shots, Example #2, 256-ball caBGA
Layer 1 Primary
Layer 2 GND
Layer 3 Power
Layer 4 Secondary
PCB Fabrication Cost and Design Rule Considerations
PCB fabrication cost is a key consideration for many electronics products. By reviewing the IC device package ball
density and pitch, I/O signal requirements of your application, and the manufacturing constraints of your PCB fabri-
cation facility you can better weigh the trade-offs between design decisions.
Choosing the best package for your application involves answering a few questions:
• What is the driving factor in the application? The smallest possible form factor or a low PCB cost?
• How many I/O signals does the application require?
• What PCB layer stack up will provide the best I/O density within budget?
• What layout design rules does the printed-circuit board (PCB) vendor support?
• How many PCB layers does the budget allow?
As the ball pitch becomes smaller with each new BGA generation, new PCB fabrication techniques and signal via
type have been developed to handle the complexities. Micro vias, laser vias, filled, buried and blind vias, even bur-
ied and plated over vias. Complex boards use a combination of most of these.
14-13
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