BAS40L NXP Semiconductors, BAS40L Datasheet - Page 18
![58T1331](/photos/40/35/403529/ge2sod882nxp-40_sml.jpg)
BAS40L
Manufacturer Part Number
BAS40L
Description
58T1331
Manufacturer
NXP Semiconductors
Datasheet
1.BAS40-04215.pdf
(21 pages)
Specifications of BAS40L
Diode Type
Fast Recovery
Forward Current If(av)
120mA
Repetitive Reverse Voltage Vrrm Max
40V
Forward Voltage Vf Max
1V
Forward Surge Current Ifsm Max
200mA
Operating Temperature Range
-65°C To
Rohs Compliant
Yes
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAS40L
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
Part Number:
BAS40L,315
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
Company:
Part Number:
BAS40LP-7
Manufacturer:
EXAR
Quantity:
1 049
Company:
Part Number:
BAS40LP-7
Manufacturer:
Diodes Inc
Quantity:
74 329
Part Number:
BAS40LP-7
Manufacturer:
DIODES/美台
Quantity:
20 000
Company:
Part Number:
BAS40LP-7-F
Manufacturer:
AD
Quantity:
12 000
Company:
Part Number:
BAS40LT1G
Manufacturer:
ON Semiconductor
Quantity:
850
Company:
Part Number:
BAS40LT1G
Manufacturer:
ON
Quantity:
33 000
Part Number:
BAS40LT1G
Manufacturer:
ON/安森美
Quantity:
20 000
NXP Semiconductors
BAS40_1PSXXSB4X_SER_8
Product data sheet
Fig 28. Reflow soldering footprint SOT416
Fig 29. Reflow soldering footprint SOT666
2
1.7
1.075
Reflow soldering is the only recommended soldering method.
0.538
0.55
(2×)
BAS40 series; 1PSxxSB4x series
Dimensions in mm
Rev. 08 — 13 January 2010
0.45
(4×)
(4×)
0.5
2.0
0.85
2.75
2.45
2.1
1.6
1.7
(3x)
0.6
0.6
solder lands
solder resist
3
0.65
(2×)
(2×)
0.7
0.6
2.2
1.9
2
1
1.1
(6×)
0.4
General-purpose Schottky diodes
0.325
0.25
(2×)
(4×)
msa438
(3x)
0.5
solder paste
occupied area
0.375
(2×)
(4×)
0.3
1.5
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
solder lands
placement area
solder paste
occupied area
sot666_fr
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