MC10H115P ON Semiconductor, MC10H115P Datasheet - Page 4

MC10H115P

Manufacturer Part Number
MC10H115P
Description
Manufacturer
ON Semiconductor
Datasheet

Specifications of MC10H115P

Number Of Receivers
4
Number Of Transmitters
Not Required
Number Of Transceivers
Not Required
Receiver Signal Type
Differential
Transmitter Signal Type
Not Required
Single Supply Voltage (typ)
-5.2V
Single Supply Voltage (min)
-4.94V
Single Supply Voltage (max)
-5.46V
Dual Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Supply Current
26mA
Power Supply Requirement
Single
Operating Temp Range
0C to 75C
Operating Temperature Classification
Commercial
Mounting
Through Hole
Pin Count
16
Package Type
PDIP
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC10H115P
Manufacturer:
TELCOM
Quantity:
9
Part Number:
MC10H115P
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
C
−L−
0.010 (0.250)
20
Z
G1
S
G
T
1
−N−
L−M
S
A
R
V
N
VIEW S
S
−M−
E
Y BRK
J
0.007 (0.180)
0.007 (0.180)
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
7. DIMENSION H DOES NOT INCLUDE DAMBAR
−T−
W
1982.
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
DATUM −T−, SEATING PLANE.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
0.004 (0.100)
SEATING
PLANE
M
M
PACKAGE DIMENSIONS
D
D
T
T
L−M
L−M
http://onsemi.com
20 LEAD PLLC
CASE 775−02
S
S
ISSUE E
N
N
B
Z
S
S
4
VIEW D−D
U
0.007 (0.180)
K1
X
0.007 (0.180)
K
M
T
VIEW S
L−M
M
G1
T
S
L−M
DIM
F
G1
K1
W
A
B
C
E
G
H
K
R
U
V
X
Y
F
J
Z
H
N
S
0.010 (0.250)
S
0.385
0.385
0.165
0.090
0.013
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
0.310
0.040
MIN
−−−
0.050 BSC
0.007 (0.180)
2
N
INCHES
0.007 (0.180)
_
S
0.395
0.395
0.180
0.110
0.019
0.032
0.356
0.356
0.048
0.048
0.056
0.020
0.330
MAX
−−−
−−−
10
−−−
_
S
M
MILLIMETERS
T
MIN
9.78
9.78
4.20
2.29
0.33
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
7.88
1.02
M
−−−
1.27 BSC
2
L−M
T
_
T
L−M
10.03
10.03
L−M
MAX
4.57
2.79
0.48
0.81
9.04
9.04
1.21
1.21
1.42
0.50
8.38
S
−−−
−−−
10
−−−
_
S
N
S
S
N
N
S
S

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