AM29DL164DB-90WCI Spansion Inc., AM29DL164DB-90WCI Datasheet - Page 11
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AM29DL164DB-90WCI
Manufacturer Part Number
AM29DL164DB-90WCI
Description
Manufacturer
Spansion Inc.
Datasheet
1.AM29DL164DB-90WCI.pdf
(57 pages)
Specifications of AM29DL164DB-90WCI
Cell Type
NOR
Density
16Mb
Access Time (max)
90ns
Interface Type
Parallel
Boot Type
Bottom
Address Bus
21/20Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
FBGA
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
2M/1M
Supply Current
16mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AM29DL164DB-90WCI
Manufacturer:
AMD
Quantity:
11 698
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability
of specific valid combinations and to check on newly released combinations.
February 26, 2009 21533E6
AM29DL161DT70, AM29DL161DB70
AM29DL162DT70, AM29DL162DB70
AM29DL163DT70, AM29DL163DB70
AM29DL164DT70, AM29DL164DB70
AM29DL161DT90, AM29DL161DB90
AM29DL162DT90, AM29DL162DB90
AM29DL163DT90, AM29DL163DB90
AM29DL164DT90, AM29DL164DB90
AM29DL161DT120, AM29DL161DB120
AM29DL162DT120, AM29DL162DB120
AM29DL163DT120, AM29DL163DB120
AM29DL164DT120, AM29DL164DB120
Am29DL16xD
Valid Combinations for TSOP Packages
Order Number
T
DEVICE NUMBER/DESCRIPTION
Am29DL16xD
16 Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS Flash Memory, 3.0 Volt-only Read, Program, and Erase
70
E
I
EI,
EF
OPTIONAL PROCESSING
Blank =
N
TEMPERATURE RANGE
F
I
PACKAGE TYPE
E
PC
WC
VR
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
B
D A T A
AM29DL161DT70, AM29DL161DB70
AM29DL162DT70, AM29DL162DB70
AM29DL163DT70, AM29DL163DB70
AM29DL164DT70, AM29DL164DB70
AM29DL161DT90, AM29DL161DB90
AM29DL162DT90, AM29DL162DB90
AM29DL163DT90, AM29DL163DB90
AM29DL164DT90, AM29DL164DB90
AM29DL161DT120, AM29DL161DB120
AM29DL162DT120, AM29DL162DB120
AM29DL163DT120, AM29DL163DB120
AM29DL164DT120, AM29DL164DB120
Note: Ordering numbers containing PCI are identified on device packages with PI. The same
applies to WCI and VI, as well as VRI and UI.
Valid Combinations
=
=
=
=
=
=
=
=
=
Am29DL16xD
Standard Processing
Industrial (–40
64-Ball Fortified Ball Grid Array
48-Ball Very Thin Profile Ball Grid Array
16-byte ESN devices
Industrial (–40
48-Pin Thin Small Outline Package (TSOP) Standard Pinout (TS 048)
1.0 mm pitch, 13 x 11 mm package (LAA064)
48-Ball Fine-Pitch Ball Grid Array
0.80 mm pitch, 8 x 9 mm package (FBC048)
0.80 mm pitch, 8.15 x 6.15 mm package (VBF048)
Top sector
Bottom sector
S H E E T
Order Number
Valid Combinations for FBGA Packages
°
°
C to +85
C to +85
°
°
C) with Pb-Free Package
C)
WCF,
WCI,
PCF,
PCI,
VRI,
VRF
D161DT70, D161DB70
D162DT70, D162DB70
D163DT70, D163DB70
D164DT70, D164DB70
D161DT90, D161DB90
D162DT90, D162DB90
D163DT90, D163DB90
D164DT90, D164DB90
D161DT12, D161DB12
D162DT12, D162DB12
D163DT12, D163DB12
D164DT12, D164DB12
Package Marking
UI,
PF,
VF,
UF
PI,
VI,
11