CY7C1360A-225BGC Cypress Semiconductor Corp, CY7C1360A-225BGC Datasheet - Page 11

• Manufacturer Part Number: CY7C1360A-225BGC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1360A-225BGC

• Density: 9Mb
• Access Time (max): 2.5ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: FBGA
• Operating Temp Range: 0C to 70C
• Supply Current: 570mA
• Operating Supply Voltage (min): 3.14V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 119
• Word Size: 36b
• Lead Free Status / Rohs Status: Not Compliant

Document #: 38-05258 Rev. *A
IEEE 1149.1 Serial Boundary Scan (JTAG)
Overview
This device incorporates a serial boundary scan access port
(TAP). This port is designed to operate in a manner consistent
with IEEE Standard 1149.1-1990 (commonly referred to as
JTAG), but does not implement all of the functions required for
IEEE 1149.1 compliance. Certain functions have been
modified or eliminated because their implementation places
extra delays in the critical speed path of the device. Never-
theless, the device supports the standard TAP controller archi-
tecture (the TAP controller is the state machine that controls
the TAPs operation) and can be expected to function in a
manner that does not conflict with the operation of devices with
IEEE Standard 1149.1-compliant TAPs. The TAP operates
using LVTTL/ LVCMOS logic level signaling.
Disabling the JTAG Feature
It is possible to use this device without using the JTAG feature.
To disable the TAP controller without interfering with normal
operation of the device, TCK should be tied LOW (V
prevent clocking the device. TDI and TMS are internally pulled
up and may be unconnected. They may alternately be pulled
up to V
Upon power-up the device will come up in a reset state which
will not interfere with the operation of the device.
Test Access Port
TCK–Test Clock (INPUT)
Clocks all TAP events. All inputs are captured on the rising
edge of TCK and all outputs propagate from the falling edge of
TCK.
TMS–Test Mode Select (INPUT)
The TMS input is sampled on the rising edge of TCK. This is
the command input for the TAP controller state machine. It is
allowable to leave this pin unconnected if the TAP is not used.
The pin is pulled up internally, resulting in a logic HIGH level.
TDI–Test Data In (INPUT)
The TDI input is sampled on the rising edge of TCK. This is the
input side of the serial registers placed between TDI and TDO.
The register placed between TDI and TDO is determined by
the state of the TAP controller state machine and the
instruction that is currently loaded in the TAP instruction
register (refer to Figure 1, TAP Controller State Diagram). It is
allowable to leave this pin unconnected if it is not used in an
application. The pin is pulled up internally, resulting in a logic
HIGH level. TDI is connected to the Most Significant Bit (MSB)
of any register (see Figure 2.).
TDO–Test Data Out (OUTPUT)
The TDO output pin is used to serially clock data-out from the
registers. The output that is active depending on the state of
the TAP state machine (refer to Figure 1, TAP Controller State
Diagram). Output changes in response to the falling edge of
TCK. This is the output side of the serial registers placed
between TDI and TDO. TDO is connected to the Least Signif-
icant Bit (LSB) of any register (see Figure 2.).
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through a resistor. TDO should be left unconnected.
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Performing a TAP Reset
The TAP circuitry does not have a reset pin (TRST, which is
optional in the IEEE 1149.1 specification). A RESET can be
performed for the TAP controller by forcing TMS HIGH (V
for five rising edges of TCK and pre-loads the instruction
register with the IDCODE command. This type of reset does
not affect the operation of the system logic. The reset affects
test logic only.
At power-up, the TAP is reset internally to ensure that TDO is
in a High-Z state.
TAP Registers
Overview
The various TAP registers are selected (one at a time) via the
sequences of ones and zeros input to the TMS pin as the TCK
is strobed. Each of the TAPs registers are serial shift registers
that capture serial input data on the rising edge of TCK and
push serial data out on subsequent falling edge of TCK. When
a register is selected, it is connected between the TDI and
TDO pins.
Instruction Register
The instruction register holds the instructions that are
executed by the TAP controller when it is moved into the run
test/idle or the various data register states. The instructions
are three bits long. The register can be loaded when it is
placed between the TDI and TDO pins. The parallel outputs of
the instruction register are automatically preloaded with the
IDCODE instruction upon power-up or whenever the controller
is placed in the test-logic reset state. When the TAP controller
is in the Capture-IR state, the two LSBs of the serial instruction
register are loaded with a binary “01” pattern to allow for fault
isolation of the board-level serial test data path.
Bypass Register
The bypass register is a single-bit register that can be placed
between TDI and TDO. It allows serial test data to be passed
through the device TAP to another device in the scan chain
with minimum delay. The bypass register is set LOW (V
when the BYPASS instruction is executed.
Boundary Scan Register
The Boundary Scan register is connected to all the input and
bidirectional I/O pins (not counting the TAP pins) on the device.
This also includes a number of NC pins that are reserved for
future needs. There are a total of 70 bits for the x36 device and
51 bits for the x18 device. The boundary scan register, under
the control of the TAP controller, is loaded with the contents of
the device I/O ring when the controller is in Capture-DR state
and then is placed between the TDI and TDO pins when the
controller is moved to Shift-DR state. The EXTEST,
SAMPLE/PRELOAD and SAMPLE-Z instructions can be used
to capture the contents of the I/O ring.
The Boundary Scan Order table describes the order in which
the bits are connected. The first column defines the bit’s
position in the boundary scan register. The MSB of the register
is connected to TDI, and LSB is connected to TDO. The
second column is the signal name, the third column is the
TQFP pin number, and the fourth column is the BGA bump
number.
CY7C1360A
CY7C1362A
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