UPD78F0034AGK-9ET Renesas Electronics America, UPD78F0034AGK-9ET Datasheet - Page 53

• Manufacturer Part Number: UPD78F0034AGK-9ET
• Manufacturer: Renesas Electronics America

Specifications of UPD78F0034AGK-9ET

• Lead Free Status / Rohs Status: Supplier Unconfirmed

(3) µ PD78F0034AGK-9ET: 64-pin plastic TQFP (12 × 12)
µ PD78F0034ACW: 64-pin plastic SDIP (19.05 mm (750))
µ PD78F0034AYCW: 64-pin plastic SDIP (19.05 mm (750))
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Wave soldering (pin only)
Partial heating
Note
Caution Do not use different soldering methods together (except for partial heating).
Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with
µ PD78F0034AYGK-9ET: 64-pin plastic TQFP (12 × 12)
Soldering Method
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
the package.
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less,
Exposure limit: 7 days
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less,
Exposure limit: 7 days
Solder bath temperature: 260°C max., Time: 10 seconds max.,
Count: Once, Preheating temperature: 120°C max. (package surface temperature),
Exposure limit: 7 days
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Table 9-1. Surface Mounting Type Soldering Conditions (2/2)
Solder bath temperature: 260°C max., Time: 10 seconds max.
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Table 9-2. Insertion Type Soldering Conditions
Note
Note
Note
(after 7 days, prebake at 125°C for 10 hours)
(after 7 days, prebake at 125°C for 10 hours)
(after 7 days, prebake at 125°C for 10 hours)
Data Sheet U14040EJ4V0DS
Soldering Conditions
Soldering Conditions
µ PD78F0034A, 78F0034AY
IR35-107-2
VP15-107-2
WS60-107-1
Condition Symbol
Recommended
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