AM29DL323DB-120EI Spansion Inc., AM29DL323DB-120EI Datasheet - Page 7

• Manufacturer Part Number: AM29DL323DB-120EI
• Manufacturer: Spansion Inc.

Specifications of AM29DL323DB-120EI

• Cell Type: NOR
• Density: 32Mb
• Access Time (max): 120ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 22/21Bit
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 3/8.5 to 9.5V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 4M/2M
• Supply Current: 16mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory products
in FBGA packages.
PIN DESCRIPTION
A0–A20
DQ0–DQ14 = 15 Data Inputs/Outputs
DQ15/A-1
CE#
OE#
WE#
WP#/ACC
RESET#
BYTE#
RY/BY#
V
V
NC
6
CC
SS
= 21 Addresses
= DQ15 (Data Input/Output, word
= Chip Enable
= Output Enable
= Write Enable
= Hardware Write Protect/
= Hardware Reset Pin, Active Low
= Selects 8-bit or 16-bit mode
= Ready/Busy Output
= 3.0 volt-only single power supply
= Device Ground
= Pin Not Connected Internally
mode), A-1 (LSB Address Input, byte
mode)
Acceleration Pin
(see Product Selector Guide for speed
options and voltage supply toler-
ances)
Am29DL322D/323D/324D
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
LOGIC SYMBOL
21
A0–A20
CE#
OE#
WE#
RESET#
BYTE#
WP#/ACC
DQ0–DQ15
RY/BY#
(A-1)
December 13, 2005
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