LMX9830SM National Semiconductor, LMX9830SM Datasheet - Page 43

• Manufacturer Part Number: LMX9830SM
• Manufacturer: National Semiconductor

Specifications of LMX9830SM

• Lead Free Status / Rohs Status: Not Compliant

PCB Land Pad Diameter
PCB Solder Mask Opening
PCB Finish (HASL details)
Stencil Aperture
Stencil Thickness
Solder Paste Used
Flux Cleaning Process
Reflow Profiles
Average Ramp-Up Rate (TsMAX to Tp)
Preheat:
Temperature Min (TsMIN)
Temperature Max (TsMAX)
Time (tsMIN to tsMAX)
Time maintained above:
Temperature (TL)
Time (tL)
Peak/Classification Temperature (Tp)
Time within 5°C of actual Peak Temperature (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Reflow Profiles
17.0 Soldering
The LMX9830 bumps are designed to melt as part of the Sur-
face Mount Assembly (SMA) process. In order to ensure
reflow of all solder bumps and maximum solder joint reliability
while minimizing damage to the package, recommended re-
flow profiles should be used.
Note 42: See IPC/JEDEC J-STD-020C, July 2004.
Note 43: All temperatures refer to the top side of the package, measured on the package body surface.
Parameter
Profile Feature
TABLE 40. Classification Reflow Profiles (Note 42), (Note 43)
FIGURE 21. Typical Reflow Profiles
TABLE 39. Soldering Details
43
Table 39, Table 40 and Figure 21provide the soldering details
required to properly solder the LMX9830 to standard PCBs.
The illustration serves only as a guide and National is not li-
able if a selected profile does not work.
See IPC/JEDEC J-STD-020C, July 2004 for more informa-
tion.
Defined by customer or manufacturing facility
Defined by customer or manufacturing facility
Defined by customer or manufacturing facility
See Figure 21
3°C/second maximum
6°C/second maximum
Value
13 mil
19 mil
17 mil
8 minutes maximum
5 mil
NOPB Assembly
20 – 40 seconds
60180 seconds
60150 seconds
See Figure 21
260 + 0°C
20180027
150°C
200°C
217°C
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