MICRF003YM TR Micrel Inc, MICRF003YM TR Datasheet - Page 11

• Manufacturer Part Number: MICRF003YM TR
• Manufacturer: Micrel Inc

Specifications of MICRF003YM TR

• Operating Temperature (min): -40C
• Operating Temperature (max): 105C
• Operating Temperature Classification: Industrial
• Product Depth (mm): 3.94mm
• Product Height (mm): 1.48mm
• Product Length (mm): 9.93mm
• Operating Supply Voltage (min): 4.75V
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Lead Free Status / Rohs Status: Compliant

October 1999
MICRF003
I/O Pin Interface Circuitry
Interface circuitry for the various I/O pins of the MICRF003
is shown in Figures 1 through 6.
regarding each of these circuits is discussed in the following
sub-paragraphs.
which are applied to all input and output pins.
1. ANT Pin
The ANT pin is internally AC-coupled via a 3pF capacitor, to
an RF N-channel MOSFET, as shown in Figure 1.
Impedance on this pin to VSS is quite high at low
frequencies, and decreases as frequency increases. In the
UHF frequency range, the device input can be modeled as
6.3k
VSSRF.
2. CTH Pin
Figure 2 illustrates the CTH pin interface circuit. CTH pin is
driven from a P-channel MOSFET source-follower biased
with approximately 10µA of bias current.
gates TG1 and TG2 isolate the 6.9pF capacitor. Internal
control signals PHI1/PHI2 are related in a manner such that
the impedance across the transmission gates looks like a
“resistance” of 90kohms. The DC potential on the CTH pin
is approximately 1.6V.
in parallel with 2pF (pin capacitance) shunt to
Not shown are ESD protection diodes
Figure 1 ANT Pin
Specific information
Transmission
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3. CAGC Pin
Figure 3 illustrates the CAGC pin interface circuit.
AGC control voltage is developed as an integrated current
into a capacitor CAGC. The attack (pulldown) current is
nominally 15 A, while the decay (pullup) current is a 1/10th
scaling of this, nominally 1.5 A, so the attack/decay
timeconstant ratio is fixed at 10:1. Signal gain of the RF/IF
strip inside the IC diminishes as the voltage on CAGC
decreases.
constant is found in “Application Note TBD. Modification of
the attack/decay ratio is possible by adding resistance from
CAGC pin either to VDDBB or VSSBB, as desired. Both the
Push and Pull current sources are disabled during SHUT,
which holds the voltage across CAGC, and improves
recovery time in duty-cycled applications.
improve duty cycle recovery, both Push and Pull currents
are increased by 45X for approximately 10msec after
release of SHUT. This allows rapid recovery of any voltage
droop on CAGC while in SHUT.
4. DO and WAKEB Output Pins
The output stage for the signals DO and WAKEB is shown
in Figure 4. The output is a 35µA push-35µA pull, switched
current stage. Such an output stage is capable of driving
CMOS-type
recommended for driving high capacitance loads.
5. REFOSC Pin
The REFOSC input circuit is shown in Figure 5.
impedance is quite high (200k ).
oscillator, with internal 30pF capacitors.
intended to work with standard ceramic resonators,
connected from this pin to VSSBB, although a crystal may
be used instead, where greater frequency accuracy is
required.
capacitors, since these capacitors are contained inside the
IC.
amplitude limited to approximately 0.5Vpp. The nominal
DC bias voltage on this pin is 1.4V.
6. Control Inputs (SEL0, SEL1, SWEN, SHUT)
Control input circuitry is shown in Figures 6a and 6b. The
standard input is a logic inverter constructed with minimum
geometry MOSFETs (Q2, Q3). P-channel MOSFET Q1 is a
large channel length device which functions essentially as a
“weak” pullup to VDDBB.
leading to an impedance to the VDDBB supply of typically
1M .
tm
Externally applied signals should be AC-coupled,
The resonators should not contain integral
Further discussion on setting the attack time
loads.
An
Typical pullup current is 5 A,
external
This is a Colpitts
buffer-driver
This input is
MICRF003
Micrel
To further
Input
The
is