TDA18271HD/C2.557 NXP Semiconductors, TDA18271HD/C2.557 Datasheet - Page 65

• Manufacturer Part Number: TDA18271HD/C2.557
• Manufacturer: NXP Semiconductors

Specifications of TDA18271HD/C2.557

• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
16. Package outline
Fig 28. Package outline SOT903-1 (HLQFN64R)
TDA18271HD_4
Product data sheet
HLQFN64R; plastic thermal enhanced low profile quad flat package; no leads;
64 terminals; resin based; body 9
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
SOT903-1
OUTLINE
max
1.7
A
E
E
m
n
0.3
0.2
E
b
k
E
l
9.1
8.9
terminal 1
index area
terminal 1
index area
D
E
L
IEC
- - -
j
2.92
2.82
L
E
D
1
h
h
16
1
17
0.86
0.76
D
64
9
j
1.6 mm
3.32
3.22
D
JEDEC
e
k
- - -
D
D
k
h
1.79
1.69
REFERENCES
D
l
e
D
1
D
Rev. 04 — 19 May 2009
2.16
2.06
j
D
D
D
0
1/2 e
l
m
m
JEITA
9.1
8.9
E
- - -
b
scale
2.5
49
0.31
0.21
E
32
h
33
48
1/2 e
0.69
0.59
e
B
E
w
5 mm
v
j
M
M
e
A
E
2
1.79
1.69
C
C
E
k
A
B
0.79
0.69
E
l
A
2.63
2.53
E
y
m
PROJECTION
1
EUROPEAN
C
0.18
0.08
2.02
1.92
TDA18271HD
E
L
1
n
detail X
0.1
0.5
v
e
X
© NXP B.V. 2009. All rights reserved.
C
0.05
7.5
e
w
Silicon Tuner IC
1
y
ISSUE DATE
06-03-29
07-11-14
0.05
7.5
e
y
2
SOT903-1
0.45
0.40
0.1
y
65 of 70
L
1