UPC2768GR-E1 CALIFORNIA EASTERN LABS, UPC2768GR-E1 Datasheet - Page 10

UPC2768GR-E1

Manufacturer Part Number
UPC2768GR-E1
Description
Manufacturer
CALIFORNIA EASTERN LABS
Datasheet

Specifications of UPC2768GR-E1

Operating Supply Voltage
3V
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Not Compliant
RECOMMENDED SOLDERING CONDITIONS
different conditions.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
8
PC2768GR
Infrared ray reflow
VPS
Wave soldering
Partial heating method
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used or in case soldering is done under
For details of recommended soldering conditions for surface mounting, refer to information document
Note 1
Caution
Soldering process
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 C and relative humidity at 65 % or less.
Do not apply more than single process at once, except for “Partial heating method”.
Peak package’s surface temperature: 235 C or below,
Reflow time: 30 seconds or below (210 C or higher),
Number of reflow process: 3, Exposure limit
Peak package’s surface temperature: 215 C or below,
Reflow time: 40 seconds or below (200 C or higher),
Number of reflow process: 3, Exposure limit
Solder temperature: 260 C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit
Terminal temperature: 300 C or below,
Flow time: 3 seconds or below,
Exposure limit
Note 1
Data Sheet P11541EJ3V0DS00
: None
Soldering conditions
Note 1
Note 1
Note 1
: None
: None
: None
WS60-00-1
VP15-00-3
IR35-00-3
Symbol
PC2768GR

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