UPC2757T Renesas Electronics America, UPC2757T Datasheet - Page 15

• Manufacturer Part Number: UPC2757T
• Manufacturer: Renesas Electronics America

Specifications of UPC2757T

• Lead Free Status / Rohs Status: Supplier Unconfirmed

NOTE ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your NEC sales representative.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Method
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (example: 1 000 pF) to the V
This product should be soldered under the following recommended conditions.
Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit: None
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit: None
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
Data Sheet P10716EJ4V0DS00
Soldering Conditions
Note
Note
Note
CC
pin.
PC2757T, PC2758T
For soldering methods and
Recommended Condition
Symbol
WS60-00-1
VP15-00-3
IR35-00-3
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