MC33263NW-30R2 ON Semiconductor, MC33263NW-30R2 Datasheet - Page 4

IC, LDO VOLT REG, 3V, 150mA, 6-SOT-23

MC33263NW-30R2

Manufacturer Part Number
MC33263NW-30R2
Description
IC, LDO VOLT REG, 3V, 150mA, 6-SOT-23
Manufacturer
ON Semiconductor
Datasheet

Specifications of MC33263NW-30R2

Primary Input Voltage
12V
Output Voltage Fixed
3V
Dropout Voltage Vdo
180mV
No. Of Pins
6
Output Current
150mA
Operating Temperature Range
-40°C to +85°C
Peak Reflow Compatible (260 C)
No
Rohs Compliant
No

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Manufacturer
Quantity
Price
Part Number:
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Manufacturer:
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Part Number:
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Manufacturer:
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Quantity:
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change in load current at constant chip temperature.
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
output with a constant load and no input ripple, measured
over a specified frequency range.
dissipation for which the regulator will operate within
specifications.
regulator chip and is not delivered to the load.
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
undershoot response when input voltage is excited with a
given slope.
circuitry is provided to protect the integrated circuit in the
event that the maximum junction temperature is exceeded.
When activated, typically 150 C, the regulator turns off.
to reduce the dynamic impedance of the supply rail that
feeds the component. A 1
tantalum is recommended and should be connected close to
the MC33263 package. Higher values will correspondingly
improve the overall line transient response.
MC33263 is a stable component and does not require any
Equivalent Series Resistance (ESR) neither a minimum
output current. Capacitors exhibiting ESRs ranging from a
few m
decoupling value is 1
stringent load transient requirements. The regulator accepts
ceramic chip capacitors as well as tantalum devices.
is a true low–noise regulator. With a 10 nF bypass capacitor,
it typically reaches the incredible level of 25
noise between 100 Hz and 100 kHz. To give maximum
insight on noise specifications, ON Semiconductor includes
spectral density graphics as well as noise dependency versus
bypass capacitor.
Load Regulation – The change in output voltage for a
Dropout Voltage – The input/output differential at which
Output Noise Voltage – The RMS AC voltage at the
Maximum Power Dissipation – The maximum total
Quiescent Current – Current which is used to operate the
Line Regulation – The change in input voltage for a
Line Transient Response – Typical over– and
Thermal Protection – Internal thermal shutdown
Input Decoupling – As with any regulator, it is necessary
Output Decoupling – Thanks to a novel concept, the
Noise Performances – Unlike other LDOs, the MC33263
W
up to 3
W
can thus safely be used. The minimum
m
F and can be augmented to fulfill
m
F capacitor either ceramic or
m
VRMS overall
APPLICATION HINTS
http://onsemi.com
DEFINITIONS
MC33263
4
This feature is provided to prevent catastrophic failures from
accidental overheating.
package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 125 C. The junction temperature is rising while the
difference between the input power (V CC X I CC ) and the
output power (V out X I out ) is increasing.
calculate the maximum power dissipation, maximum load
current or maximum input voltage (see Application Hints:
Protection).
is a lot increased when using appropriate application design.
Mounting pad configuration on the PCB, the board material
and also the ambient temperature are affected the rate of
temperature rise. It means that when the I C has good thermal
conductivity through PCB, the junction temperature will be
“low” even if the power dissipation is great.
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature (150 C for MC33263) and ambient
temperature.
MC33263 as depicted by the data–sheet curves. A typical
1 ms settling time is achieved with a 10 nF bypass capacitor.
However, thanks to its low–noise architecture, the
MC33263 can operate without bypass and thus offers a
typical 20
noise stays lower than 65
100 kHz.
conferring natural ruggedness and reliability to the products
implementing the component. The output current is
internally limited to a minimum of 175 mA while
temperature shutdown occurs if the die heats up beyond
150 C. These value lets you assess the maximum
differential voltage the device can sustain at a given output
current before its protections come into play.
by:
Maximum Package Power Dissipation – The maximum
Depending on ambient temperature, it is possible to
The maximum power dissipation supported by the device
The thermal resistance of the whole circuit can be
Then you can calculate the power dissipation by
The bypass capacitor impacts the start–up phase of the
Protections – The MC33263 hosts several protections,
The maximum dissipation the package can handle is given
m
s start–up phase. In that case, the typical output
P max
+
T
Jmax
R
q
JA
m
– T
VRMS between 100 Hz –
A

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