LFSC3GA15E-5FN900C Lattice, LFSC3GA15E-5FN900C Datasheet - Page 222
LFSC3GA15E-5FN900C
Manufacturer Part Number
LFSC3GA15E-5FN900C
Description
IC FPGA 15.2KLUTS 900FPBGA
Manufacturer
Lattice
Datasheet
1.LFSC3GA15E-5FN256C.pdf
(237 pages)
Specifications of LFSC3GA15E-5FN900C
Number Of Logic Elements/cells
*
Number Of Labs/clbs
*
Total Ram Bits
*
Number Of I /o
*
Number Of Gates
*
Voltage - Supply
*
Mounting Type
*
Operating Temperature
*
Package / Case
*
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFSC3GA15E-5FN900C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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- Download datasheet (3Mb)
Pinout Information
Lattice Semiconductor
LatticeSC/M Family Data Sheet
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following located on the Lattice website at
www.latticesemi.com.
• Thermal Management document
• Technical Note TN1101 - Power Estimation and Management for LatticeSC Devices
• Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from
www.latticesemi.com/software
4-148
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