LTC2954CTS8-2#PBF Linear Technology, LTC2954CTS8-2#PBF Datasheet - Page 15
LTC2954CTS8-2#PBF
Manufacturer Part Number
LTC2954CTS8-2#PBF
Description
Manufacturer
Linear Technology
Datasheet
1.LTC2954CTS8-2PBF.pdf
(18 pages)
Specifications of LTC2954CTS8-2#PBF
Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Operating Temperature (max)
70C
Rad Hardened
No
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LTC2954CTS8-2#PBFLTC2954CTS8-2#TRMPBF
Manufacturer:
Linear Technology
Quantity:
1 944
2.55 ±0.05
PACKAGE DESCRIPTION
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.15 ±0.05
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
0.25 ± 0.05
0.61 ±0.05
(2 SIDES)
2.20 ±0.05
(2 SIDES)
0.50 BSC
0.70 ±0.05
PACKAGE
OUTLINE
(Reference LTC DWG # 05-08-1702 Rev B)
(SEE NOTE 6)
8-Lead Plastic DFN (3mm × 2mm)
TOP MARK
PIN 1 BAR
0.200 REF
DDB Package
3.00 ±0.10
(2 SIDES)
0.75 ±0.05
2.00 ±0.10
(2 SIDES)
0 – 0.05
R = 0.05
0.56 ± 0.05
(2 SIDES)
TYP
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.15 ±0.05
(2 SIDES)
LTC2954
8
1
0.50 BSC
0.40 ± 0.10
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
(DDB8) DFN 0905 REV B
15
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