AUIRF2903ZS International Rectifier, AUIRF2903ZS Datasheet

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AUIRF2903ZS

Manufacturer Part Number
AUIRF2903ZS
Description
MOSFET Power
Manufacturer
International Rectifier
Datasheet

Specifications of AUIRF2903ZS

Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
235 A
Power Dissipation
231 W
Mounting Style
SMD/SMT
Package / Case
D2PAK
Gate Charge Qg
160 nC
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AUIRF2903ZS
Manufacturer:
IR
Quantity:
12 500
Specifically designed for Automotive applications, this
HEXFET
techniques to achieve extremely low on-resistance per silicon
area. Additional features of this design are a 175°C junction
operating temperature, fast switching speed and improved
repetitive avalanche rating . These features combine to make
this design an extremely efficient and reliable device for use in
Automotive applications and a wide variety of other applications.
Absolute Maximum Ratings
specifications is not implied.
HEXFET
*Qualification standards can be found at http://www.irf.com/
www.irf.com
Features
Description
I
I
I
I
P
V
E
E
I
E
T
T
R
R
R
Thermal Resistance
D
D
D
DM
AR
J
STG
D
GS
AS
AS
AR
JC
JA
JA
@ T
@ T
@ T
@T
Advanced Process Technology
Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
(Tested )
C
C
C
C
®
= 25°C
= 100°C
= 25°C
= 25°C
®
is a registered trademark of International Rectifier.
Power MOSFET utilizes the latest processing
Continuous Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy (Thermally limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Junction-to-Case
Junction-to-Ambient
Junction-to-Ambient (PCB Mount, steady state)
functional operation of the device at these or any other condition beyond those indicated in the
j
Ã
Parameter
Parameter
GS
GS
GS
g
@ 10V
@ 10V
@ 10V
AUTOMOTIVE GRADE
(Silicon Limited)
(Silicon Limited)
(Package Limited)
h
i
d
G
Gate
G
D
AUIRF2903ZS
Typ.
–––
–––
–––
See Fig.12a, 12b, 15, 16
300 (1.6mm from case )
D
2
Pak
D
S
-55 to + 175
G
HEXFET
D
235
166
160
Max.
1020
1.54
231
± 20
231
820
S
Drain
k
k
k
V
R
I
I
D
D (Silicon Limited)
D (Package Limited)
(BR)DSS
DS(on)
Max.
0.65
®
AUIRF2903ZS
AUIRF2903ZL
62
40
Power MOSFET
D
typ.
max.
AUIRF2903ZL
TO-262
Source
PD - 96380
S
G
235A
1.9m
2.4m
160A
D
Units
Units
30V
W/°C
°C/W
S
mJ
mJ
°C
W
A
V
A
1

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